Converting Technology Exhibition Seminar
E : English Session
S : Simultaneous Interpretation
J : Japanese Session
Jan. 29 (Wed.)
| Material Stage (West Hall 3) | Convertech Stage (West Hall 4) | ||
| 9:00 | |||
|---|---|---|---|
| 10:00 | |||
5G Keynote Speech 10:20-11:00 Osaka University Flexible ultra-small signal sensing technology for future healthcare and telemedicine 11:10-11:50 HUAWEI TECHNOLOGIES JAPAN K.K. Global 5G commercial status and Huawei's engagements 12:00-12:40 Osaka Research Institute of Industrial Science and Technology | 3Dimensions Scan Technology Association "Manufacturing Quality Improving Measuring Technologies" 10:20-11:10 haraseisakusyo co.,ltd. 3D-SCAN Reverse Engineering services 11:20-12:10 AIC-VISION Corporation | ||
| 11:00 | |||
| 12:00 | |||
Multi-material 12:35-13:15 National Institute of Advanced Industrial Science and Technology(AIST) 13:20-13:50 AIST Characterization of adhesive dissimilar joint properties and analysis of the joint mechanism 13:55-14:25 National Institute of Advanced Industrial Science and Technology (AIST) Biodegradation of Biodegradable Plastics in Seawater 14:30-15:00 Tendo Co.,Ltd. Multi-material softwood and its application to parts for automobile | |||
| 13:00 | Special Program Organized by Society for Specialty Film "5G, IoT: Resulting Social Changes and Anticipated Functional Films" 13:05-14:05 NTT DOCOMO, INC. Initiatives for Business Co-creation in the 5G Era 14:05-15:05 Seiko Instruments Inc. Introduction for Wireless Sensor Network Systems. 15:20-16:20 AGC Inc Development trends of fluoro materials used in high-frequency, high-speed printed circuit boards 16:20-16:40 | ||
| 14:00 | |||
| 15:00 | |||
Functional Material Session 15:10-15:40 HAMAMTSU PHOTONICS K.K. | |||
| 16:00 | |||
| 17:00 | |||
Jan. 30 (Thu.)
| Material Stage (West Hall 3) | Convertech Stage (West Hall 4) | ||
| 9:00 | |||
|---|---|---|---|
| 10:00 | |||
Decoration Technology Keynote Speech 10:20-11:00 MTO Technology Office and The Association of Decoration Technology The Front of Plastic Surface Decoration Technology 11:10-11:40 FUJIFILM Corporation On-demand decoration technology to meet individual customer needs 11:50-12:20 MORROW / CREATION What's kind 3D surface, Designers wants. 12:30-13:10 Fu-se Vacuum Forming Ltd. | JFlex : Society 5.0 Supporting Applied Sensor Technologies in the Health and Nursing Care Fields Keynote Speech 10:20-11:10 KDDI Research, Inc. What can we measure to understand human being? 11:25-11:55 ND Software Co., Ltd. How can Society 5.0 change the field of nursing and medical care? 12:10-12:40 Future Ink Corporation | ||
| 11:00 | |||
| 12:00 | |||
12:55-13:25 JFlex AWARD | |||
| 13:00 | |||
Please enter Material Stage from 13:25 to 13:45 if you are member of the Association of Decoration Technology. 13:25-13:45 | |||
JFlex : Startup Session 13:40-14:10 Nikkei Inc. How to create global startups from Japan 14:20-14:40 OMUTSU-TECH 14:40-14:55 REAL TECH FUND 14:55-15:15 Wonder Future Corporation Soldering technique on Low Heat resistant Film substrate with IH Reflow 15:15-15:30 aba Inc. | |||
| 14:00 | Special Program Organized by the Association of Decoration Technology 14:05-14:35 PIXEL.A Corporation 14:40-15:10 Teikoku Printing Inks Mfg.Co.,Ltd. Value added printing realized by screen printing. 15:15-15:45 YAMAHA MOTOR CO.,LTD. Development of Converting technology in YAMAHA Motor 15:45-16:05 The Association of Decoration Technology Members' presentation by The Association of Decoration Technology | ||
| 15:00 | |||
| 16:00 | |||
| 17:00 | |||
Jan. 31 (Fri.)
| Material Stage (West Hall 3) | Convertech Stage (West Hall 4) | ||
| 9:00 | |||
|---|---|---|---|
| 10:00 | |||
The Forefront of a Responsible Plastics Industry for a Sustainable Society Keynote Speech 10:15-10:55 The University of Tokyo Biodegradable Plastics for the Future 11:05-11:35 Total Corbion PLA b.v. Japan Representative Office Polylactic acid (PLA) ~Improvement of performance to expand applications 11:45-12:15 Oji F-Tex Co.,Ltd. 12:25-12:55 Coca-Cola Japan Company, Limited | |||
Material Design / Development Simulation 10:20-10:50 President, Products Innovation Association and Prof. Emeritus, the University of Tokyo Method for solving manufacturing issues 11:00-11:30 Representative of Study Group for Molecular Simulation, Japan Society for Composite Materials / Tokyo University of Science Molecular simulation of composite manufacturing 11:40-12:10 MI-6 Ltd. Current Status and Prospects of Materials Informatics in Industry 12:20-12:50 Nature Architects Inc. | |||
| 11:00 | |||
| 12:00 | |||
| 13:00 | Printed Electronics Seminar 13:00-13:30 Mitsubishi Chemical Corporation 13:40-14:10 SEIKO EPSON Corp. Introduction of Inkjet machine for R&D with precision core head 14:20-14:50 SP-SOLUTIONS 15:00-15:30 Tohoku University New FHE Technology and Application Based on Advanced Wafer-Level Packaging 15:40-16:10 YUPO CORPORATION Introduction of piezoelectric YUPO and a example of its comercialization. | ||
Flexible Production - Printing/Sensors/Materials Keynote Speech 13:10-13:50 KINYOSHA PRINTING CO., LTD The state and challenges of digital printing in the flexible packaging industry 14:05-14:35 Pi-Crystal, Inc. Innovating IoT with Flexible and Thin CMOS ICs using Organic Semiconductor 14:50-15:20 KNC Laboratories Co., Ltd. Custom-made synthesis in line with your demand-KNC Laboratories works 15:30-16:15 FUJIFILM Global Graphic Systems Co., Ltd. | |||
| 14:00 | |||
| 15:00 | |||
| 16:00 | |||
| 17:00 | |||
