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1.29(Wed.) - 31(Fri.) 2020 Tokyo Big Sight West Hall 3-4 10:00-17:00


Converting Technology Exhibition Seminar

E : English Session

S : Simultaneous Interpretation

J : Japanese Session

Jan. 29 (Wed.)

  Material Stage (West Hall 3) Convertech Stage (West Hall 4)
9:00  
  
  
  
  
  
  
  
  
  
  
  
10:00  
  
  
  

5G

Keynote Speech

10:20-11:00

Osaka University

Flexible ultra-small signal sensing technology for future healthcare and telemedicine

11:10-11:50

HUAWEI TECHNOLOGIES JAPAN K.K.

Global 5G commercial status and Huawei's engagements

12:00-12:40

Osaka Research Institute of Industrial Science and Technology

Issues of electromagnetic compatibility and materials for high-frequency applications in the era of 5G

3Dimensions Scan Technology Association "Manufacturing Quality Improving Measuring Technologies"

10:20-11:10

haraseisakusyo co.,ltd.

3D-SCAN Reverse Engineering services

11:20-12:10

AIC-VISION Corporation
Casley Consulting, Inc.

A new machine vision application by combining image sharpening technology (deconvolution method using integral geometry) and Phantom high-speed camera.

11:00
12:00
 
 
 
 

Multi-material

12:35-13:15

National Institute of Advanced Industrial Science and Technology(AIST)

AIST Consortium: Building industry-academia-government collaboration using the Technological Consortium for Adhesion and Bonding (T-CAB)

13:20-13:50

AIST

Characterization of adhesive dissimilar joint properties and analysis of the joint mechanism

13:55-14:25

National Institute of Advanced Industrial Science and Technology (AIST)

Biodegradation of Biodegradable Plastics in Seawater

14:30-15:00

Tendo Co.,Ltd.

Multi-material softwood and its application to parts for automobile

 
 
 
 
13:00

Special Program Organized by Society for Specialty Film "5G, IoT: Resulting Social Changes and Anticipated Functional Films"

13:05-14:05

NTT DOCOMO, INC.

Initiatives for Business Co-creation in the 5G Era

14:05-15:05

Seiko Instruments Inc.

Introduction for Wireless Sensor Network Systems.

15:20-16:20

AGC Inc

Development trends of fluoro materials used in high-frequency, high-speed printed circuit boards

16:20-16:40

14:00
15:00 
 

Functional Material Session

15:10-15:40

HAMAMTSU PHOTONICS K.K.

New functions added to materials! What are the benefits of introducing low-energy electron beams to the industry?

16:00
 
 
 
 
 
  
  
  
17:00  
  
  
  
  
  
  
  
  
  
  
  

Jan. 30 (Thu.)

  Material Stage (West Hall 3) Convertech Stage (West Hall 4)
9:00  
  
  
  
  
  
  
  
  
  
  
  
10:00  
  
  
  

Decoration Technology

Keynote Speech

10:20-11:00

MTO Technology Office and The Association of Decoration Technology

The Front of Plastic Surface Decoration Technology

11:10-11:40

FUJIFILM Corporation

On-demand decoration technology to meet individual customer needs

11:50-12:20

MORROW / CREATION

What's kind 3D surface, Designers wants.

12:30-13:10

Fu-se Vacuum Forming Ltd.

TOM machine continues to evolve! (Lab size ~ Ultra-wide size!) Contribute to the world beyond 3D surface decoration!

JFlex : Society 5.0 Supporting Applied Sensor Technologies in the Health and Nursing Care Fields

Keynote Speech

10:20-11:10

KDDI Research, Inc.

What can we measure to understand human being?

11:25-11:55

ND Software Co., Ltd.

How can Society 5.0 change the field of nursing and medical care?

12:10-12:40

Future Ink Corporation

Practical use of bed sensor "Vital Beats" for healthcare and nursing care. - in addition to heart beat and breathing, you can monitor the depth of sleep -

11:00
12:00
 
 
 

12:55-13:25

JFlex AWARD

13:00
 
 
 

Please enter Material Stage from 13:25 to 13:45 if you are member of the Association of Decoration Technology.

13:25-13:45

 
 
 

JFlex : Startup Session

13:40-14:10

Nikkei Inc.

How to create global startups from Japan

14:20-14:40

OMUTSU-TECH

14:40-14:55

REAL TECH FUND

How we change the world

14:55-15:15

Wonder Future Corporation

Soldering technique on Low Heat resistant Film substrate with IH Reflow

15:15-15:30

aba Inc.

Care for Needed, as Needed

 
 
 
14:00

Special Program Organized by the Association of Decoration Technology

14:05-14:35

PIXEL.A Corporation

surface design trend 2019

14:40-15:10

Teikoku Printing Inks Mfg.Co.,Ltd.

Value added printing realized by screen printing.

15:15-15:45

YAMAHA MOTOR CO.,LTD.

Development of Converting technology in YAMAHA Motor

15:45-16:05

The Association of Decoration Technology

Members' presentation by The Association of Decoration Technology

15:00
 
 
 
 
16:00 
  
  
  
  
  
  
  
  
  
  
  
17:00  
  
  
  
  
  
  
  
  
  
  
  

Jan. 31 (Fri.)

  Material Stage (West Hall 3) Convertech Stage (West Hall 4)
9:00  
  
  
  
  
  
  
  
  
  
  
  
10:00  
  
  

The Forefront of a Responsible Plastics Industry for a Sustainable Society

Keynote Speech

10:15-10:55

The University of Tokyo

Biodegradable Plastics for the Future

11:05-11:35

Total Corbion PLA b.v. Japan Representative Office

Polylactic acid (PLA) ~Improvement of performance to expand applications

11:45-12:15

Oji F-Tex Co.,Ltd.

Effort to reduce consumption of plastics by replacing with pulp materials -New paper based barrier material, "Silbio Barrier"-

12:25-12:55

Coca-Cola Japan Company, Limited

Package strategy of Coca-Cola

 

Material Design / Development Simulation

10:20-10:50

President, Products Innovation Association and Prof. Emeritus, the University of Tokyo

Method for solving manufacturing issues

11:00-11:30

Representative of Study Group for Molecular Simulation, Japan Society for Composite Materials / Tokyo University of Science

Molecular simulation of composite manufacturing

11:40-12:10

MI-6 Ltd.

Current Status and Prospects of Materials Informatics in Industry

12:20-12:50

Nature Architects Inc.

Direct Functional Modeling

11:00
12:00
 
  
13:00 

Printed Electronics Seminar

13:00-13:30

Mitsubishi Chemical Corporation

Development of novel highly-flexible/stretchable epoxy film with thermal stability and optical transparency

13:40-14:10

SEIKO EPSON Corp.

Introduction of Inkjet machine for R&D with precision core head

14:20-14:50

SP-SOLUTIONS

Application of GENSINK (France) silver nano ink and transparent conductive silver nanowire ink by screen printing method

15:00-15:30

Tohoku University

New FHE Technology and Application Based on Advanced Wafer-Level Packaging

15:40-16:10

YUPO CORPORATION

Introduction of piezoelectric YUPO and a example of its comercialization.

 

Flexible Production - Printing/Sensors/Materials

Keynote Speech

13:10-13:50

KINYOSHA PRINTING CO., LTD

The state and challenges of digital printing in the flexible packaging industry

14:05-14:35

Pi-Crystal, Inc.

Innovating IoT with Flexible and Thin CMOS ICs using Organic Semiconductor

14:50-15:20

KNC Laboratories Co., Ltd.

Custom-made synthesis in line with your demand-KNC Laboratories works

15:30-16:15

FUJIFILM Global Graphic Systems Co., Ltd.

Value from digital printing for flexible package

14:00
15:00
 
 
 
 
 
 
 
 
16:00 
 
  
  
  
  
  
  
  
  
  
  
17:00