Converting Technology Exhibition Seminar
E : English Session
S : Simultaneous Interpretation
J : Japanese Session
Jan. 29 (Wed.)
| Material Stage (West Hall 3) | Convertech Stage (West Hall 4) | ||
| 9:00 | |||
|---|---|---|---|
| 10:00 | |||
5G Keynote Speech 10:20-11:00 Osaka University Flexible ultra-small signal sensing technology for future healthcare and telemedicine 12:00-12:40 Osaka Research Institute of Industrial Science and Technology | 3Dimensions Scan Technology Association "Manufacturing Quality Improving Measuring Technologies" 11:20-12:10 AIC-VISION Corporation | ||
| 11:00 | |||
| 12:00 | |||
Multi-material 12:35-13:15 National Institute of Advanced Industrial Science and Technology(AIST) 13:20-13:50 AIST Characterization of adhesive dissimilar joint properties and analysis of the joint mechanism 13:55-14:25 National Institute of Advanced Industrial Science and Technology (AIST) | |||
| 13:00 | Special Program Organized by Society for Specialty Film "5G, IoT: Resulting Social Changes and Anticipated Functional Films" | ||
| 14:00 | |||
| 15:00 | |||
Functional Material Session 15:10-15:40 HAMAMTSU PHOTONICS K.K. | |||
| 16:00 | |||
| 17:00 | |||
Jan. 30 (Thu.)
| Material Stage (West Hall 3) | Convertech Stage (West Hall 4) | ||
| 9:00 | |||
|---|---|---|---|
| 10:00 | |||
Decoration Technology Keynote Speech 10:20-11:00 MTO Technology Office and The Association of Decoration Technology 12:30-13:10 Fu-se Vacuum Forming Ltd. | JFlex : Society 5.0 Supporting Applied Sensor Technologies in the Health and Nursing Care Fields Keynote Speech | ||
| 11:00 | |||
| 12:00 | |||
12:55-13:25 JFlex AWARD | |||
| 13:00 | |||
Please enter Material Stage from 13:25 to 13:45 if you are member of the Association of Decoration Technology. | |||
JFlex : Startup Session 14:55-15:15 Wonder Future Corporation Soldering technique on Low Heat resistant Film substrate with IH Reflow | |||
| 14:00 | Special Program Organized by the Association of Decoration Technology 15:45-16:05 The Association of Decoration Technology Members' presentation by The Association of Decoration Technology | ||
| 15:00 | |||
| 16:00 | |||
| 17:00 | |||
Jan. 31 (Fri.)
| Material Stage (West Hall 3) | Convertech Stage (West Hall 4) | ||
| 9:00 | |||
|---|---|---|---|
| 10:00 | |||
The Forefront of a Responsible Plastics Industry for a Sustainable Society Keynote Speech 11:05-11:35 Total Corbion PLA b.v. Japan Representative Office Polylactic acid (PLA) ~Improvement of performance to expand applications 11:45-12:15 Oji F-Tex Co.,Ltd. | |||
Material Design / Development Simulation 10:20-10:50 President, Products Innovation Association and Prof. Emeritus, the University of Tokyo 11:00-11:30 Representative of Study Group for Molecular Simulation, Japan Society for Composite Materials / Tokyo University of Science | |||
| 11:00 | |||
| 12:00 | |||
| 13:00 | Printed Electronics Seminar 13:00-13:30 Mitsubishi Chemical Corporation 14:20-14:50 SP-SOLUTIONS 15:00-15:30 Tohoku University New FHE Technology and Application Based on Advanced Wafer-Level Packaging 15:40-16:10 YUPO CORPORATION Introduction of piezoelectric YUPO and a example of its comercialization. | ||
Flexible Production - Printing/Sensors/Materials Keynote Speech 13:10-13:50 KINYOSHA PRINTING CO., LTD The state and challenges of digital printing in the flexible packaging industry 14:05-14:35 Pi-Crystal, Inc. Innovating IoT with Flexible and Thin CMOS ICs using Organic Semiconductor 14:50-15:20 KNC Laboratories Co., Ltd. Custom-made synthesis in line with your demand-KNC Laboratories works 15:30-16:15 FUJIFILM Global Graphic Systems Co., Ltd. | |||
| 14:00 | |||
| 15:00 | |||
| 16:00 | |||
| 17:00 | |||
