10:15-10:45

Pre-Registration not requiredFree

11:00-11:30

Pre-Registration not requiredFree

11:45-12:15

Pre-Registration not requiredFree
ZUKEN Inc.

Introducing 3D-MID and the next-generation cutting-edge semiconductor package design environment

10:30-10:50

Pre-Registration not requiredFree
Techno Alpha Co.,Ltd.

Making PCB boards and substrates without outsourcing, Prototyping boards of flexible electronics Electronic Circuit Printer V-ONE / NOVA

11:05-11:25

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WonderFutureCorporation

Total support for social implementation of 3D-MID/PE and the decarbonization in the electronic board field with IH reflow technology

11:40-12:00

Pre-Registration not requiredFree
Sanoh Industrial Co., Ltd.

Development of Miniaturized, High-Temperature and High-Capacity Rechargeable Solid-State Batteries

12:15-12:35

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LPKF Laser&Electronics K.K.

Micro features on glass substrate - LPKF LIDE technology introduction

12:50-13:10

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Dynatron CO.,LTD.

Dynatron product introduction

13:25-13:45

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LE-TECHNOLOGY Co., Ltd.

Introducing LE-TECHNOLOGY's most advanced direct exposure equipment

14:00-14:20

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Toshiba Information System Japan

Using AI to improve the efficiency of LSI evaluation work How to use the automatic waveform characteristics judgment software Waveform meister

14:35-14:55

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Sankyosha Co.,Ltd.

About LTspice New Version

15:10-15:30

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Sankyosha Co.,Ltd.

About LTspice New Version

15:45-16:05

Pre-Registration not requiredFree
Hanel Production and Import - Export Joint Stock Company

Introducing Hanel PT

16:20-16:40

Pre-Registration not requiredFree
Electro Scientific Industries Japan Co., Ltd.

Green Technology - Enabling Productivity and Sustainability for IC Substrate Manufacturing

13:00-13:20

Pre-Registration not requiredFree
Tokyo University of Science Faculty of Science and Technology Department of Electrical Engineering
Tokyo University of Science Faculty of Science and Technology Department of Mechanical and Aerospace Engineering

Prototype of a skin equivalent phantom for electroencephalograph and investigation of the difference in noise affected by the measurement environment on EEG measurement

13:20-13:40

Pre-Registration not requiredFree
Dept. of Electrical Engineering, Tokyo University of Science
Dept. of Applied Biological Science, Tokyo University of Science

Sterilization effect of viable bacteria in low-temperature cooking using dielectric heating

13:40-14:00

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Tokyo university of science

Prototype production of optical stimulation device for small laboratory animals that implements wireless power and performance evaluation through animal experiments

14:00-14:20

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Advanced Magnetic Devices (Sato & Sonehara) Lab., Dep. of Elect. and Computer Eng., Fac. of Eng., Shinshu Univ.


Nakayama Lab., Course of Mech. Robot., Dep. of Eng., NIT,Nagano College

Development of A Few GHz Band Thin Film Common-Mode Filter With Broudband Filtering and Low Group-Delay Characteristic

14:20-14:40

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Sojo University

Wearable biological information sensor system in LIvestock and Zoo Animals

15:00-15:20

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Graduate School of Engineering, Tokyo Polytechnic University

Low Profile Broadband Circularly-Polarized Patch Antenna Using Metamaterial With Rings

15:20-15:40

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Tokyo Polytechnic University

Investigation of transmission characteristics of coplanar lines using ITO transparent conductive film

15:40-16:00

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Granduate School of Engineering, Tokyo Polytechnic University

Investigation of Widening Radiation Angle for Patch Antennas with Stepped Ground Plane

16:00-16:20

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Graduate School of Engineering, Tokyo Polytechnic University

Investigation of Magnetic Field Distributions of Transcutaneous Information Transmission Using Spiral Coil against Misalignment

10:15-10:45

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11:00-11:30

Pre-Registration not requiredFree

11:45-12:15

Pre-Registration not requiredFree

10:30-10:50

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MacDermidalpha

Shadow Plus A High Conductivity, Low Etch Amount and Highly Sustainability Direct Metallization Process

11:05-11:25

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C.Uyemura & Co.,Ltd.

Electrolytic copper plating bath for high density penetrate through hole core board

11:40-12:00

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SHIBUYA CORPORATION

Introduction of Shibuya's laser ablation processing machine and FPC and PCB processing examples.

12:15-12:35

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NAITO DENSEI MACHIDA MFG.CO.,LTD.

Achieve Ultra-Low Power Operation! Introducing the Bluetooth Virtual Mesh Network.

12:50-13:10

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LPKF Laser&Electronics K.K.

The new era of PCB depaneling - LPKF laser depaneling technology seminar

13:25-13:45

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BRUX JAPAN CO., LTD.

Solution for Contamination Defect in PCB/SMT manufactureing ~Fundamentals for reliable and safe cleaning for small contaminartion less than 100µm~

14:00-14:20

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Oxford Instruments KK

Example of high-speed, high-resolution elemental map analysis of electronic components using Unity, an innovative detector that simultaneously detects reflected electrons and X-rays

14:35-14:55

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Introducing SCREEN’s latest technology with direct imaging equipment (Ledia series) for package substrate.

15:10-15:30

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TA Instruments Japan

Characterization of materials on electric devices using combined analysis of thermal analysis, rheology, and more.

15:45-16:05

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Techno Alpha.Co.LTD

New approach to SMT reflow from IBL, Germany

16:20-16:40

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ORC MANUFACTURING CO., LTD.

High-density advanced PKG has become a reality! Introduction of excimer laser processing system Exa-Ms5 that enables ultra-fine via processing Φ3um, and the ultimate direct exposure device GDi-MPv2.

13:00-13:20

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Faculty of Science and Engineering, Gunma University

Low temperature precision solid phase bonding of electronic packaging materials by metal salt generation bonding method

13:20-13:40

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Graduate School of Science and Technology, Gunma University

Chemically Control of Low-temperature Sintering Behavior and Interfacial Properties with Copper Electrodes of Silver Micro-flakes-filled Electrically Conductive Adhesives

13:40-14:00

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Graduate School of Science and Technology

Enhancement of Electrical Reliability of Copper-filled Conductive Pastes by the Oxidation Tolerance Design

14:00-14:20

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Yokohama National University

Characterization of Bond Interface and Strength Measurement for Hybrid Bonding

14:20-14:40

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Yonezawa Lab., Faculty of Engineering, Hokkaido Univ.

Low-temperature sintering of copper particle system enabling high-strength bonding.

15:00-15:20

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Koiwa Lab., Graduate School of Engineering, Kanto Gakuin Univ.

Effects of Addition a Small Amount of Quaternary Ammonium Salts to Aluminum Electrodeposition in Deep Eutectic Solvents

15:20-15:40

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Koiwa Lab., Graduate School of Engineering Kanto Gakuin Univ.


Japan Kanigen Co., Ltd.

Selective deposition of electroless copper plating on electroless nickel-phosphorus thin films selectively deposited by UV irradiation

15:40-16:00

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Tohoku University

Conversion of Polysilazane into Silica for Wafer Bonding at Room Temperature

16:00-16:20

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Doshisha University graduate student

Doshisha University

Prediction of blind via hole quality based on ensemble learning for laser drilling condition of printed circuit boards.

16:20-16:40

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Doshisha University graduate student

Construction and analysis of a support system for setting cutting conditions of PCB drills by machine learning of carbide drill catalog data

16:40-17:00

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DENSHIGIKEN Co.,Ltd.

Direct Adhesion base on Plasma-Induced Surface Modification for Next Generation PCB Manufacturing

15:00-15:30

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DX was could become lively by "notice" -Let's start by "looking"-

10:15-10:45

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11:00-11:30

Pre-Registration not requiredFree

11:45-12:15

Pre-Registration not requiredFree

10:30-10:50

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Okuno Chemical Industries Co., Ltd.

Additive for rough surface copper film on lead frames for power devices "TOP CLUSTER AR"

11:05-11:25

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V Technology Co., Ltd.

V Technology’s IT solutions for the manufacturing industry

11:40-12:00

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Musashi Engineering, INC.

Introduction of despensing technology for large boards and tall components.

12:15-12:35

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UNION TOOL CO.

The latest technical information for PCB tools.

12:50-13:10

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WonderFutureCorporation

Total support for social implementation of 3D-MID/PE and the decarbonization in the electronic board field with IH reflow technology

13:25-13:45

Pre-Registration not requiredFree
N/A

N/A

14:00-14:20

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IDAJ Co., LTD.

How to effectively use thermal simulation tools to help front-loading thermal design

14:35-14:55

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ONTEC CO.,LTD.

Live Demonstration of Ontec's In-House Developed AI Tool for Automated PCB Layout!!

15:10-15:30

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Schmalz K.K.

New era of PCB transfer ! : Lightweight, flexible, efficiency gripper from Schmalz

15:45-16:05

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Toyo Aluminium K.K.

Palladium Catalyzed Aluminum Foil Prompts Innovation in Ultra-Fine and High-Frequency Packaging Substrates(A-SAP Technology)

16:20-16:40

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TOPPAN Inc.

RDL Embedded Coreless Substrate (Organic Interposer) for Heterogeneous Integration

13:00-13:20

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Osaka Electro-Communication University

Similarity Region Extraction in Electrical Circuits Using Graph Neural Networks (GNN)

13:20-13:40

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Ehime University






TAKAYA Corporation

Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

13:40-14:00

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Tokushima University
Tokushima University
The Open University of Japan

Development of Boundary Scan Design for Automatic Interconnect Testing of Stand-by Mode ICs and its System Controller

14:00-14:20

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Sanyo-Onoda City University


Lotus Thermal Solution, Inc

Proposal of Visualization and High-Speed Quality Assurance Techniques for Passing Flow between Fins to Elucidate the Mechanism of Air Cooling Performance Improvement of Lotus Corrugated Fins

14:20-14:40

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National Institute of Technology (KOSEN), Nagano College

Development of a System to Notice Warning Sounds with Deep Learning for the Deaf and Hard of Hearing

15:00-15:20

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Nihon University / Micro Design Laboratory

Development of a Neural Network Model for Bipedal Gait Control Capable of Switching Gait and Crossing Over Obstacles

15:20-15:40

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Micro Design Laboratory, Nihon University

Dynamics Analysis of Walking for Practical Application of MEMS Micro Robots

15:40-16:00

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Nihon University Micro Design Laboratory

Development of Endoscope-Connected MEMS Microrobot Driven by Compressed Pressurized Gas

16:00-16:20

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Nihon University Micro Design Laboratory

Development of an Ultra-Compact MEMS Vapor Chamber that Suppresses Temperature Rise in Electronic Devices

16:20-16:40

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Department of Precision Machinery Engineering, Graduate School of Science and Technology, Nihon University



Department of Precision Machinery Engineering, College of Science and Technology, Nihon University

Development of Rotary-Type Electrostatic Motor for MEMS Microrobot