10:15-10:45

Pre-Registration not requiredFree

11:00-11:30

Pre-Registration not requiredFree

11:45-12:15

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10:30-10:50

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Techno Alpha Co.,Ltd.

Making PCB boards and substrates without outsourcing, Prototyping boards of flexible electronics Electronic Circuit Printer V-ONE / NOVA

11:05-11:25

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WonderFutureCorporation

Total support for social implementation of 3D-MID/PE and the decarbonization in the electronic board field with IH reflow technology

11:40-12:00

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Sanoh Industrial Co., Ltd.

Development of Miniaturized, High-Temperature and High-Capacity Rechargeable Solid-State Batteries

12:15-12:35

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LPKF Laser&Electronics K.K.

Micro features on glass substrate - LPKF LIDE technology introduction

12:50-13:10

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Dynatron CO.,LTD.

Dynatron product introduction

13:25-13:45

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LE-TECHNOLOGY Co., Ltd.

Introducing LE-TECHNOLOGY's most advanced direct exposure equipment

14:00-14:20

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Toshiba Information System Japan

Using AI to improve the efficiency of LSI evaluation work How to use the automatic waveform characteristics judgment software Waveform Meister

14:35-14:55

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Sankyosha Co.,Ltd.

About LTspice New Version

15:10-15:30

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Sankyosha Co.,Ltd.

About LTspice New Version

15:45-16:05

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Hanel Production and Import - Export Joint Stock Company

Introducing Hanel PT

16:20-16:40

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Electro Scientific Industries Japan Co., Ltd.

Green Technology - Enabling Productivity and Sustainability for IC Substrate Manufacturing

13:00-13:20

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Tokyo University of Science Faculty of Science and Technology Department of Electrical Engineering
Tokyo University of Science Faculty of Science and Technology Department of Mechanical and Aerospace Engineering

Prototype of a skin equivalent phantom for electroencephalograph and investigation of the difference in noise affected by the measurement environment on EEG measurement

13:20-13:40

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Dept. of Electrical Engineering, Tokyo University of Science
Dept. of Applied Biological Science, Tokyo University of Science

Sterilization effect of viable bacteria in low-temperature cooking using dielectric heating

13:40-14:00

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Tokyo university of science

Prototype production of optical stimulation device for small laboratory animals that implements wireless power and performance evaluation through animal experiments

14:00-14:20

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Advanced Magnetic Devices (Sato & Sonehara) Lab., Dep. of Elect. and Computer Eng., Fac. of Eng., Shinshu Univ.


Nakayama Lab., Course of Mech. Robot., Dep. of Eng., NIT,Nagano College

Development of A Few GHz Band Thin Film Common-Mode Filter With Broudband Filtering and Low Group-Delay Characteristic

14:20-14:40

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Sojo University

Wearable biological information sensor system in LIvestock and Zoo Animals

15:00-15:20

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Graduate School of Engineering, Tokyo Polytechnic University

Low Profile Broadband Circularly-Polarized Patch Antenna Using Metamaterial With Rings

15:20-15:40

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Tokyo Polytechnic University

Investigation of transmission characteristics of coplanar lines using ITO transparent conductive film

15:40-16:00

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Granduate School of Engineering, Tokyo Polytechnic University

Investigation of Widening Radiation Angle for Patch Antennas with Stepped Ground Plane

16:00-16:20

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Graduate School of Engineering, Tokyo Polytechnic University

Investigation of Magnetic Field Distributions of Transcutaneous Information Transmission Using Spiral Coil against Misalignment

10:15-10:45

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11:00-11:30

Pre-Registration not requiredFree

11:45-12:15

Pre-Registration not requiredFree

10:30-10:50

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MacDermidalpha

Shadow Plus A High Conductivity, Low Etch Amount and Highly Sustainability Direct Metallization Process

11:05-11:25

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C.Uyemura & Co.,Ltd.

Electrolytic copper plating bath for high density penetrate through hole core board

11:40-12:00

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SHIBUYA CORPORATION

Introduction of Shibuya's laser ablation processing machine and FPC and PCB processing examples.

12:15-12:35

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NAITO DENSEI MACHIDA MFG.CO.,LTD.

Achieve Ultra-Low Power Operation! Introducing the Bluetooth Virtual Mesh Network.

12:50-13:10

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LPKF Laser&Electronics K.K.

The new era of PCB depaneling - LPKF laser depaneling technology seminar

13:25-13:45

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BRUX JAPAN CO., LTD.

Solution for Contamination Defect in PCB/SMT manufactureing ~Fundamentals for reliable and safe cleaning for small contaminartion less than 100µm~

14:00-14:20

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Oxford Instruments KK

Example of high-speed, high-resolution elemental map analysis of electronic components using Unity, an innovative detector that simultaneously detects reflected electrons and X-rays

14:35-14:55

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Introducing SCREEN’s latest technology with direct imaging equipment (Ledia series) for package substrate.

15:10-15:30

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TA Instruments Japan

Characterization of materials on electric devices using combined analysis of thermal analysis, rheology, and more.

15:45-16:05

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New approach to SMT reflow from IBL, Germany

16:20-16:40

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ORC MANUFACTURING CO., LTD.

High-density advanced PKG has become a reality! Introduction of excimer laser processing system Exa-Ms5 that enables ultra-fine via processing Φ3um, and the ultimate direct exposure device GDi-MPv2.

13:00-13:20

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Faculty of Science and Engineering, Gunma University

Low temperature precision solid phase bonding of electronic packaging materials by metal salt generation bonding method

13:20-13:40

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Graduate School of Science and Technology, Gunma University

Chemically Control of Low-temperature Sintering Behavior and Interfacial Properties with Copper Electrodes of Silver Micro-flakes-filled Electrically Conductive Adhesives

13:40-14:00

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Graduate School of Science and Technology

Enhancement of Electrical Reliability of Copper-filled Conductive Pastes by the Oxidation Tolerance Design

14:00-14:20

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Yokohama National University

Characterization of Bond Interface and Strength Measurement for Hybrid Bonding

14:20-14:40

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Yonezawa Lab., Faculty of Engineering, Hokkaido Univ.

Low-temperature sintering of copper particle system enabling high-strength bonding.

15:00-15:20

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Koiwa Lab., Graduate School of Engineering, Kanto Gakuin Univ.

Effects of Addition a Small Amount of Quaternary Ammonium Salts to Aluminum Electrodeposition in Deep Eutectic Solvents

15:20-15:40

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Koiwa Lab., Graduate School of Engineering Kanto Gakuin Univ.


Japan Kanigen Co., Ltd.

Selective deposition of electroless copper plating on electroless nickel-phosphorus thin films selectively deposited by UV irradiation

15:40-16:00

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Tohoku University

Conversion of Polysilazane into Silica for Wafer Bonding at Room Temperature

16:00-16:20

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Doshisha University graduate student

Doshisha University

Prediction of blind via hole quality based on ensemble learning for laser drilling condition of printed circuit boards.

16:20-16:40

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Doshisha University graduate student

Construction and analysis of a support system for setting cutting conditions of PCB drills by machine learning of carbide drill catalog data

16:40-17:00

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DENSHIGIKEN Co.,Ltd.

Direct Adhesion base on Plasma-Induced Surface Modification for Next Generation PCB Manufacturing

15:00-15:30

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DX was could become lively by "notice" -Let's start by "looking"-

10:15-10:45

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11:00-11:30

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11:45-12:15

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10:30-10:50

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Okuno Chemical Industries Co., Ltd.

Additive for rough surface copper film on lead frames for power devices "TOP CLUSTER AR"

11:05-11:25

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V Technology Co., Ltd.

V Technology’s IT solutions for the manufacturing industry

11:40-12:00

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Musashi Engineering, INC.

Introduction of despensing technology for large boards and tall components.

12:15-12:35

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UNION TOOL CO.

The latest technical information for PCB tools.

12:50-13:10

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WonderFutureCorporation

Total support for social implementation of 3D-MID/PE and the decarbonization in the electronic board field with IH reflow technology

13:25-13:45

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N/A

N/A

14:00-14:20

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IDAJ Co., LTD.

How to effectively use thermal simulation tools to help front-loading thermal design

14:35-14:55

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ONTEC CO.,LTD.

Live Demonstration of Ontec's In-House Developed AI Tool for Automated PCB Layout!!

15:10-15:30

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Schmalz K.K.

New era of PCB transfer ! : Lightweight, flexible, efficiency gripper from Schmalz

15:45-16:05

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Toyo Aluminium K.K.

Palladium Catalyzed Aluminum Foil Prompts Innovation in Ultra-Fine and High-Frequency Packaging Substrates(A-SAP Technology)

16:20-16:40

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TOPPAN Inc.

RDL Embedded Coreless Substrate (Organic Interposer) for Heterogeneous Integration

13:00-13:20

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Osaka Electro-Communication University

Similarity Region Extraction in Electrical Circuits Using Graph Neural Networks (GNN)

13:20-13:40

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Ehime University






TAKAYA Corporation

Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

13:40-14:00

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Tokushima University
Tokushima University
The Open University of Japan

Development of Boundary Scan Design for Automatic Interconnect Testing of Stand-by Mode ICs and its System Controller

14:00-14:20

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Sanyo-Onoda City University


Lotus Thermal Solution, Inc

Proposal of Visualization and High-Speed Quality Assurance Techniques for Passing Flow between Fins to Elucidate the Mechanism of Air Cooling Performance Improvement of Lotus Corrugated Fins

14:20-14:40

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National Institute of Technology (KOSEN), Nagano College

Development of a System to Notice Warning Sounds with Deep Learning for the Deaf and Hard of Hearing

15:00-15:20

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Nihon University / Micro Design Laboratory

Development of a Neural Network Model for Bipedal Gait Control Capable of Switching Gait and Crossing Over Obstacles

15:20-15:40

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Micro Design Laboratory, Nihon University

Dynamics Analysis of Walking for Practical Application of MEMS Micro Robots

15:40-16:00

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Nihon University Micro Design Laboratory

Development of Endoscope-Connected MEMS Microrobot Driven by Compressed Pressurized Gas

16:00-16:20

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Nihon University Micro Design Laboratory

Development of an Ultra-Compact MEMS Vapor Chamber that Suppresses Temperature Rise in Electronic Devices

16:20-16:40

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Department of Precision Machinery Engineering, Graduate School of Science and Technology, Nihon University



Department of Precision Machinery Engineering, College of Science and Technology, Nihon University

Development of Rotary-Type Electrostatic Motor for MEMS Microrobot