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Wednesday – Friday, June 12-14, 2024 Tokyo Big Sight East Exhibition Halls


出展者(NPI)プレゼンテーション/3D-MIDセミナー/アカデミックプラザ/Electronics Component & Unit Show 出展者プレゼンテーション

No mark : Japanese Session

Jun. 12 (Wed.)
  Seminar Venue D Seminar Venue E Seminar Venue F
9:00   
   
   
   
   
   
   
   
   
   
   
   
10:00   
   
   
 

3D-MID

10:15-10:45

Pre-Registration not requiredFree










11:00-11:30

Pre-Registration not requiredFree










 
  
  

NPI Presentation

11:40-12:00

Pre-Registration not requiredFree
Sanoh Industrial Co., Ltd.









Development of Miniaturized, High-Temperature and High-Capacity Rechargeable Solid-State Batteries

12:15-12:35

Pre-Registration not requiredFree
LPKF Laser&Electronics K.K.









Micro features on glass substrate - LPKF LIDE technology introduction

12:50-13:10

Pre-Registration not requiredFree
Dynatron CO.,LTD.









Dynatron product introduction

13:25-13:45

Pre-Registration not requiredFree
LE-TECHNOLOGY Co., Ltd.









Introducing LE-TECHNOLOGY's most advanced direct exposure equipment

14:35-14:55

Pre-Registration not requiredFree
Sankyosha Co.,Ltd.









About LTspice New Version

15:10-15:30

Pre-Registration not requiredFree
Sankyosha Co.,Ltd.









About LTspice New Version

15:45-16:05

Pre-Registration not requiredFree
Hanel Production and Import - Export Joint Stock Company









Introducing Hanel PT

16:20-16:40

Pre-Registration not requiredFree
Electro Scientific Industries Japan Co., Ltd.









Green Technology - Enabling Productivity and Sustainability for IC Substrate Manufacturing

 
 
 
 
 
 
11:00 
 
 
 
 
 
 
 
 
 
 
 
12:00 
 
 
  
  
  
  
  
  
  
  
  
13:00

Academic Plaza

13:00-13:20

Pre-Registration not requiredFree
Tokyo University of Science Faculty of Science and Technology Department of Electrical Engineering
Tokyo University of Science Faculty of Science and Technology Department of Mechanical and Aerospace Engineering








Prototype of a skin equivalent phantom for electroencephalograph and investigation of the difference in noise affected by the measurement environment on EEG measurement

13:20-13:40

Pre-Registration not requiredFree
Dept. of Electrical Engineering, Tokyo University of Science
Dept. of Applied Biological Science, Tokyo University of Science








Sterilization effect of viable bacteria in low-temperature cooking using dielectric heating

14:00-14:20

Pre-Registration not requiredFree
Advanced Magnetic Devices (Sato & Sonehara) Lab., Dep. of Elect. and Computer Eng., Fac. of Eng., Shinshu Univ.


Nakayama Lab., Course of Mech. Robot., Dep. of Eng., NIT,Nagano College






Development of A Few GHz Band Thin Film Common-Mode Filter With Broudband Filtering and Low Group-Delay Characteristic

14:20-14:40

Pre-Registration not requiredFree
Sojo University









Wearable biological information sensor system in LIvestock and Zoo Animals

 
 
 
 
 
 
 
 
 
 
 
 
14:00 
 
 
 
 
 
 
 
  
  
  
  
15:00

Academic Plaza

15:00-15:20

Pre-Registration not requiredFree
Graduate School of Engineering, Tokyo Polytechnic University









Low Profile Broadband Circularly-Polarized Patch Antenna Using Metamaterial With Rings

15:20-15:40

Pre-Registration not requiredFree
Tokyo Polytechnic University









Investigation of transmission characteristics of coplanar lines using ITO transparent conductive film

15:40-16:00

Pre-Registration not requiredFree
Granduate School of Engineering, Tokyo Polytechnic University









Investigation of Widening Radiation Angle for Patch Antennas with Stepped Ground Plane

16:00-16:20

Pre-Registration not requiredFree
Graduate School of Engineering, Tokyo Polytechnic University









Investigation of Magnetic Field Distributions of Transcutaneous Information Transmission Using Spiral Coil against Misalignment

 
 
 
 
 
 
 
 
 
 
 
 
16:00 
 
 
 
  
  
  
  
   
   
   
   
17:00   
   
   
   
   
   
   
   
   
   
   
   
  • Seminar Venue D
  • Seminar Venue E
  • Seminar Venue F
Jun. 13 (Thu.)
  Seminar Venue D Seminar Venue E Seminar Venue F
9:00   
   
   
   
   
   
   
   
   
   
   
   
10:00   
   
   
 

3D-MID

10:15-10:45

Pre-Registration not requiredFree










11:00-11:30

Pre-Registration not requiredFree










11:45-12:15

Pre-Registration not requiredFree










 
  
  

NPI Presentation

11:05-11:25

Pre-Registration not requiredFree
C.Uyemura & Co.,Ltd.









Electrolytic copper plating bath for high density penetrate through hole core board

12:15-12:35

Pre-Registration not requiredFree
NAITO DENSEI MACHIDA MFG.CO.,LTD.









Achieve Ultra-Low Power Operation! Introducing the Bluetooth Virtual Mesh Network.

12:50-13:10

Pre-Registration not requiredFree
LPKF Laser&Electronics K.K.









The new era of PCB depaneling - LPKF laser depaneling technology seminar

15:45-16:05

Pre-Registration not requiredFree
Techno Alpha.Co.LTD









New approach to SMT reflow from IBL, Germany

 
 
 
 
 
 
11:00 
 
 
 
 
 
 
 
 
 
 
 
12:00 
 
 
  
  
  
  
  
  
  
  
  
13:00

Academic Plaza

13:00-13:20

Pre-Registration not requiredFree
Faculty of Science and Engineering, Gunma University









Low temperature precision solid phase bonding of electronic packaging materials by metal salt generation bonding method

13:40-14:00

Pre-Registration not requiredFree
Graduate School of Science and Technology









Enhancement of Electrical Reliability of Copper-filled Conductive Pastes by the Oxidation Tolerance Design

14:00-14:20

Pre-Registration not requiredFree
Yokohama National University









Characterization of Bond Interface and Strength Measurement for Hybrid Bonding

14:20-14:40

Pre-Registration not requiredFree
Yonezawa Lab., Faculty of Engineering, Hokkaido Univ.









Low-temperature sintering of copper particle system enabling high-strength bonding.

 
 
 
 
 
 
 
 
 
 
 
 
14:00 
 
 
 
 
 
 
 
  
  
  
  
15:00

Academic Plaza

15:00-15:20

Pre-Registration not requiredFree
Koiwa Lab., Graduate School of Engineering, Kanto Gakuin Univ.









Effects of Addition a Small Amount of Quaternary Ammonium Salts to Aluminum Electrodeposition in Deep Eutectic Solvents

15:20-15:40

Pre-Registration not requiredFree
Koiwa Lab., Graduate School of Engineering Kanto Gakuin Univ.


Japan Kanigen Co., Ltd.






Selective deposition of electroless copper plating on electroless nickel-phosphorus thin films selectively deposited by UV irradiation

15:40-16:00

Pre-Registration not requiredFree
Tohoku University









Conversion of Polysilazane into Silica for Wafer Bonding at Room Temperature

16:00-16:20

Pre-Registration not requiredFree
Doshisha University graduate student

Doshisha University







Prediction of blind via hole quality based on ensemble learning for laser drilling condition of printed circuit boards.

16:40-17:00

Pre-Registration not requiredFree
DENSHIGIKEN Co.,Ltd.









Direct Adhesion base on Plasma-Induced Surface Modification for Next Generation PCB Manufacturing

15:00-15:30

Pre-Registration not requiredFree










DX was could become lively by "notice" -Let's start by "looking"-

 
 
 
 
 
 
16:00 
 
 
 
 
 
 
 
  
  
  
  
17:00   
   
   
   
   
   
   
   
   
   
   
   
  • Seminar Venue D
  • Seminar Venue E
  • Seminar Venue F
Jun. 14 (Fri.)
  Seminar Venue D Seminar Venue E Seminar Venue F
9:00   
   
   
   
   
   
   
   
   
   
   
   
10:00   
   
   
 

3D-MID

10:15-10:45

Pre-Registration not requiredFree










11:00-11:30

Pre-Registration not requiredFree










11:45-12:15

Pre-Registration not requiredFree










 
  
  

NPI Presentation

10:30-10:50

Pre-Registration not requiredFree
Okuno Chemical Industries Co., Ltd.









Additive for rough surface copper film on lead frames for power devices "TOP CLUSTER AR"

11:05-11:25

Pre-Registration not requiredFree
V Technology Co., Ltd.









V Technology’s IT solutions for the manufacturing industry

11:40-12:00

Pre-Registration not requiredFree
Musashi Engineering, INC.









Introduction of despensing technology for large boards and tall components.

12:15-12:35

Pre-Registration not requiredFree
UNION TOOL CO.









The latest technical information for PCB tools.

13:25-13:45

Pre-Registration not requiredFree
N/A









N/A

14:00-14:20

Pre-Registration not requiredFree
IDAJ Co., LTD.









How to effectively use thermal simulation tools to help front-loading thermal design

14:35-14:55

Pre-Registration not requiredFree
ONTEC CO.,LTD.









Live Demonstration of Ontec's In-House Developed AI Tool for Automated PCB Layout!!

15:10-15:30

Pre-Registration not requiredFree
Schmalz K.K.









New era of PCB transfer ! : Lightweight, flexible, efficiency gripper from Schmalz

16:20-16:40

Pre-Registration not requiredFree
TOPPAN Inc.









RDL Embedded Coreless Substrate (Organic Interposer) for Heterogeneous Integration

 
 
 
 
 
 
11:00 
 
 
 
 
 
 
 
 
 
 
 
12:00 
 
 
  
  
  
  
  
  
  
  
  
13:00

Academic Plaza

13:00-13:20

Pre-Registration not requiredFree
Osaka Electro-Communication University









Similarity Region Extraction in Electrical Circuits Using Graph Neural Networks (GNN)

13:20-13:40

Pre-Registration not requiredFree
Ehime University






TAKAYA Corporation


Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

13:40-14:00

Pre-Registration not requiredFree
Tokushima University
Tokushima University
The Open University of Japan







Development of Boundary Scan Design for Automatic Interconnect Testing of Stand-by Mode ICs and its System Controller

14:20-14:40

Pre-Registration not requiredFree
National Institute of Technology (KOSEN), Nagano College









Development of a System to Notice Warning Sounds with Deep Learning for the Deaf and Hard of Hearing

 
 
 
 
 
 
 
 
 
 
 
 
14:00 
 
 
 
 
 
 
 
  
  
  
  
15:00

Academic Plaza

15:00-15:20

Pre-Registration not requiredFree
Nihon University / Micro Design Laboratory









Development of a Neural Network Model for Bipedal Gait Control Capable of Switching Gait and Crossing Over Obstacles

15:20-15:40

Pre-Registration not requiredFree
Micro Design Laboratory, Nihon University









Dynamics Analysis of Walking for Practical Application of MEMS Micro Robots

15:40-16:00

Pre-Registration not requiredFree
Nihon University Micro Design Laboratory









Development of Endoscope-Connected MEMS Microrobot Driven by Compressed Pressurized Gas

16:00-16:20

Pre-Registration not requiredFree
Nihon University Micro Design Laboratory









Development of an Ultra-Compact MEMS Vapor Chamber that Suppresses Temperature Rise in Electronic Devices

16:20-16:40

Pre-Registration not requiredFree
Department of Precision Machinery Engineering, Graduate School of Science and Technology, Nihon University



Department of Precision Machinery Engineering, College of Science and Technology, Nihon University





Development of Rotary-Type Electrostatic Motor for MEMS Microrobot

 
 
 
 
 
 
 
 
 
 
 
 
16:00 
 
 
 
 
 
 
 
   
   
   
   
17:00   
   
   
   
   
   
   
   
   
   
   
   
  • Seminar Venue D
  • Seminar Venue E
  • Seminar Venue F