Seminar | JPCA Show/Microelectronics Show/JISSO PROTEC/METAVERSE DEVICE EXPO/WIRE Japan Show/JEP/TEPShow/E-Textile/Smart Sensing/Unmanned Solution Exhibition/Edge Computing

Jun. 12, 2024 (Wed.) 10:15 ~ 11:05

Seminar Venue F
Smart Sensing/Automated Solution Exhibition /Edge Computing Keynote

Pre-Registration required

10:15-11:05

Pudu Robotics
CEO

Jun. 12, 2024 (Wed.) 10:15 ~ 12:15

Seminar Venue E
3D-MID

Pre-Registration not required

11:45-12:15

Introducing 3D-MID and the next-generation cutting-edge semiconductor package design environment

Mr. Matsuzawa Hirohiko
ZUKEN Inc.
R&B Division

Jun. 12, 2024 (Wed.) 10:15 ~ 12:45

JEIP Symposium A
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 12, 2024 (Wed.) 10:15 ~ 12:45

JEIP Symposium B
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 12, 2024 (Wed.) 10:30 ~ 11:15

Seminar Venue C
Pre-Registration not required

10:30-11:15

Systems Solutions for Glass and Organic Substrates for next Generation Advanced Packaging

Mr. Jang Don
Atotech Japan K.K.

Jun. 12, 2024 (Wed.) 10:30 ~ 11:20

Seminar Venue A: Keynote
Keynote

Pre-Registration required

Admission Fee required

10:30-11:20

AI chip impact has ushered in an era of great leaps forward for semiconductors and printed circuit boards!

Mr. Wataru Izumiya
Sangyo Times,Inc

Jun. 12, 2024 (Wed.) 10:30 ~ 11:20

Seminar Venue G
JISSO PROTEC Special Session

Pre-Registration required

10:30-11:20

The latest industry trends and outlook on mobile devices

Mr. Yasuo Nakane
Mizuho Securities Co., Ltd.

Jun. 12, 2024 (Wed.) 10:30 ~ 16:40

Seminar Venue D
NPI Presentation

Pre-Registration not required

10:30-10:50

Making PCB boards and substrates without outsourcing, Prototyping boards of flexible electronics Electronic Circuit Printer V-ONE / NOVA

Mr. Haru Wakasugi
Techno Alpha Co.,Ltd.

11:05-11:25

Total support for social implementation of 3D-MID/PE and the decarbonization in the electronic board field with IH reflow technology

Mr. fukuda koki
WonderFutureCorporation
CEO

11:40-12:00

Development of Miniaturized, High-Temperature and High-Capacity Rechargeable Solid-State Batteries

Mr. Yu Maeda
Sanoh Industrial Co., Ltd.
Technical Headquarters Research and Development Division

12:15-12:35

Micro features on glass substrate - LPKF LIDE technology introduction

Mr. Kamidate Hiroyuki
LPKF Laser&Electronics K.K.
Technical Sales
Sales Director

12:50-13:10

Dynatron product introduction

Mr. Tomokazu Murai
Dynatron CO.,LTD.

13:25-13:45

Introducing LE-TECHNOLOGY's most advanced direct exposure equipment

Mr. KANAMROI TATSUYA
LE-TECHNOLOGY Co., Ltd.
Sales department

14:00-14:20

Using AI to improve the efficiency of LSI evaluation work
How to use the automatic waveform characteristics judgment software Waveform meister

Mr. togashi masahiro
Toshiba Information System Japan

14:35-14:55

About LTspice New Version

Mr. Michio Shibuya
Sankyosha Co.,Ltd.

15:10-15:30

About LTspice New Version

Mr. Michio Shibuya
Sankyosha Co.,Ltd.

15:45-16:05

Introducing Hanel PT

Ms. Trang Tran Thi Thu
Hanel Production and Import - Export Joint Stock Company
Sales Department
President

16:20-16:40

Green Technology - Enabling Productivity and Sustainability for IC Substrate Manufacturing

Mr. Chris Ryder
Electro Scientific Industries Japan Co., Ltd.
Business Dvelopment / MKS
Director of Business Development

Jun. 12, 2024 (Wed.) 11:30 ~ 12:20

Seminar Venue A: Keynote
Keynote

Pre-Registration required

Admission Fee required

11:30-12:20

The R&D situation and the development situation of devices for mobility application.

Mr. Hiroshi Iwatsubo
Murata Manufacturing Co., Ltd.
Corporate Technology & Business Development
Senior Executive Vice President (Board Member)

Jun. 12, 2024 (Wed.) 11:35 ~ 12:25

Seminar Venue F
Smart Sensing/Automated Solution Exhibition /Edge Computing Keynote

Pre-Registration required

Jun. 12, 2024 (Wed.) 11:45 ~ 16:00

Seminar Venue H
PROTEC Seminar

11:45-12:30

Introduction of despensing technology for large boards and tall components.

Mr. Takeshi Arai
Musashi Engineering, INC.
Marketing Strategy Division
Assistant Manager

12:55-13:40

2024 Useful solder printing process technology for actual production

Mr. Wakabayashi Toshimasa
YAMAHA MOTOR CO.,LTD.

14:05-14:50

The contribution Fuji printers make to printing technology and the improvement and reform of production sites

Mr. Sakurayama Takeshi
FUJI CORPORATION
Robotic Solutions Division PM Project
PM Project Leader

15:15-16:00

Evolution of Edge Machine to Achieve Autonomous Factory~Auto Setting Feeder~

Mr. Isobata Yoshinori
Panasonic Connect Co., Ltd.
Process Automation Business Division Circuit Formation Processes Coordination Department Floor Automation Development Department
Senior Manager

Jun. 12, 2024 (Wed.) 13:00 ~ 14:40

Seminar Venue E
Academic Plaza

Pre-Registration not required

13:00-13:20

Prototype of a skin equivalent phantom for electroencephalograph and investigation of the difference in noise affected by the measurement environment on EEG measurement

Yoshiki Nagasawa
Tokyo University of Science Faculty of Science and Technology Department of Electrical Engineering

13:00-13:20

Prototype of a skin equivalent phantom for electroencephalograph and investigation of the difference in noise affected by the measurement environment on EEG measurement

Hiroshi Takemura
Tokyo University of Science Faculty of Science and Technology Department of Mechanical and Aerospace Engineering

13:00-13:20

Prototype of a skin equivalent phantom for electroencephalograph and investigation of the difference in noise affected by the measurement environment on EEG measurement

Takahiko Yamamoto

Tokyo University of Science Faculty of Science and Technology Department of Electrical Engineering

13:20-13:40

Sterilization effect of viable bacteria in low-temperature cooking using dielectric heating

Kei Imai
Dept. of Electrical Engineering, Tokyo University of Science

13:20-13:40

Sterilization effect of viable bacteria in low-temperature cooking using dielectric heating

Yuuki Furuyama
Dept. of Applied Biological Science, Tokyo University of Science

13:20-13:40

Sterilization effect of viable bacteria in low-temperature cooking using dielectric heating

Kouji Kuramochi

Dept. of Applied Biological Science, Tokyo University of Science

13:20-13:40

Sterilization effect of viable bacteria in low-temperature cooking using dielectric heating

Takahiko Yamamoto

Dept. of Electrical Engineering, Tokyo University of Science

13:40-14:00

Prototype production of optical stimulation device for small laboratory animals that implements wireless power and performance evaluation through animal experiments

Hayato Kamataki
Tokyo university of science

13:40-14:00

Prototype production of optical stimulation device for small laboratory animals that implements wireless power and performance evaluation through animal experiments

Daisuke Yamada

Tokyo university of science

13:40-14:00

Prototype production of optical stimulation device for small laboratory animals that implements wireless power and performance evaluation through animal experiments

Akiyoshi Saitou

Tokyo university of science

13:40-14:00

Prototype production of optical stimulation device for small laboratory animals that implements wireless power and performance evaluation through animal experiments

Takahiko Yamamoto

Tokyo university of science

14:00-14:20

Development of A Few GHz Band Thin Film Common-Mode Filter With Broudband Filtering and Low Group-Delay Characteristic

Rei Handa
Advanced Magnetic Devices (Sato & Sonehara) Lab., Dep. of Elect. and Computer Eng., Fac. of Eng., Shinshu Univ.

14:00-14:20

Development of A Few GHz Band Thin Film Common-Mode Filter With Broudband Filtering and Low Group-Delay Characteristic

Hodaka Ito

Advanced Magnetic Devices (Sato & Sonehara) Lab., Dep. of Elect. and Computer Eng., Fac. of Eng., Shinshu Univ.

14:00-14:20

Development of A Few GHz Band Thin Film Common-Mode Filter With Broudband Filtering and Low Group-Delay Characteristic

Makoto Sonehara

Advanced Magnetic Devices (Sato & Sonehara) Lab., Dep. of Elect. and Computer Eng., Fac. of Eng., Shinshu Univ.

14:00-14:20

Development of A Few GHz Band Thin Film Common-Mode Filter With Broudband Filtering and Low Group-Delay Characteristic

Hidetoshi Nakayama
Nakayama Lab., Course of Mech. Robot., Dep. of Eng., NIT,Nagano College

14:00-14:20

Development of A Few GHz Band Thin Film Common-Mode Filter With Broudband Filtering and Low Group-Delay Characteristic

Kotaro Shirota

Advanced Magnetic Devices (Sato & Sonehara) Lab., Dep. of Elect. and Computer Eng., Fac. of Eng., Shinshu Univ.

14:00-14:20

Development of A Few GHz Band Thin Film Common-Mode Filter With Broudband Filtering and Low Group-Delay Characteristic

Kohei Nishimuta

Advanced Magnetic Devices (Sato & Sonehara) Lab., Dep. of Elect. and Computer Eng., Fac. of Eng., Shinshu Univ.

14:00-14:20

Development of A Few GHz Band Thin Film Common-Mode Filter With Broudband Filtering and Low Group-Delay Characteristic

Toshiro Sato

Advanced Magnetic Devices (Sato & Sonehara) Lab., Dep. of Elect. and Computer Eng., Fac. of Eng., Shinshu Univ.

14:20-14:40

Wearable biological information sensor system in LIvestock and Zoo Animals

HIROFUMI NOGAMI
Sojo University

Jun. 12, 2024 (Wed.) 13:00 ~ 16:05

Seminar Venue C

Jun. 12, 2024 (Wed.) 13:00 ~ 16:30

Seminar Venue B
Print Banjuku Seminar

Pre-Registration not required

Jun. 12, 2024 (Wed.) 13:30 ~ 14:30

Seminar Venue I
Roadmap Seminar

Pre-Registration not required

Jun. 12, 2024 (Wed.) 13:30 ~ 16:00

JEIP Symposium A
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 12, 2024 (Wed.) 13:30 ~ 16:00

JEIP Symposium B
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 12, 2024 (Wed.) 13:45 ~ 14:25

Seminar Venue F
Smart Sensing/無人化ソリューション展/Edge Computing

Pre-Registration required

Jun. 12, 2024 (Wed.) 14:45 ~ 15:25

Seminar Venue F
Smart Sensing Exhibitor Presentation

Pre-Registration required

14:45-15:25

How to aim for monetization in the field of extreme environments
Discovery and development of civilian technologies

Mr. Kenichi Kobayashi
NPO Robotic Increase Center/RobotMedia.LTD,

14:45-15:25

How to aim for monetization in the field of extreme environments
Discovery and development of civilian technologies

Mr. Aki Minami
Acquisition,Technology and Logistics Agency

Jun. 12, 2024 (Wed.) 15:00 ~ 16:20

Seminar Venue E
Academic Plaza

Pre-Registration not required

15:00-15:20

Low Profile Broadband Circularly-Polarized Patch Antenna Using Metamaterial With Rings

Sadaharu Isayama
Graduate School of Engineering, Tokyo Polytechnic University

15:00-15:20

Low Profile Broadband Circularly-Polarized Patch Antenna Using Metamaterial With Rings

Fukuro Koshiji

Graduate School of Engineering, Tokyo Polytechnic University

15:20-15:40

Investigation of transmission characteristics of coplanar lines using ITO transparent conductive film

Tetsuya Kitayama
Tokyo Polytechnic University

15:40-16:00

Investigation of Widening Radiation Angle for Patch Antennas with Stepped Ground Plane

Yoshinori Sasaki
Granduate School of Engineering, Tokyo Polytechnic University

16:00-16:20

Investigation of Magnetic Field Distributions of Transcutaneous Information Transmission Using Spiral Coil against Misalignment

Tatsuhiro Ichikawa
Graduate School of Engineering, Tokyo Polytechnic University

16:00-16:20

Investigation of Magnetic Field Distributions of Transcutaneous Information Transmission Using Spiral Coil against Misalignment

Fukuro Koshiji

Graduate School of Engineering, Tokyo Polytechnic University

Jun. 13, 2024 (Thu.) 10:15 ~ 11:05

Seminar Venue F
Smart Sensing/Automated Solution Exhibition /Edge Computing Keynote

Pre-Registration required

10:15-11:05

Expansion of virtual economy through interverse technology

Dr. Mochimaru Masaaki
The National Institute of Advanced Industrial Science and Technology
Human Augmentation Research Center
Fellow and Director

Jun. 13, 2024 (Thu.) 10:15 ~ 12:15

Seminar Venue E
3D-MID

Pre-Registration not required

Jun. 13, 2024 (Thu.) 10:15 ~ 12:45

JEIP Symposium A
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 13, 2024 (Thu.) 10:15 ~ 12:45

JEIP Symposium B
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 13, 2024 (Thu.) 10:30 ~ 11:20

Seminar Venue A: Keynote
Keynote

Pre-Registration required

Admission Fee required

10:30-11:20

spintronic low power semiconductors - For contributing to an advanced information society and low carbon society -

Prof. Tetsuo Endoh
Tohoku University
Center for Innovative Integrated Electronic Systems
Director / Professor

Tohoku University
Graduate School of Engineering
Professor

Jun. 13, 2024 (Thu.) 10:30 ~ 11:20

Seminar Venue G
JISSO PROTEC Special Session

Pre-Registration required

10:30-11:20

Technical Strategy of xEV in 2030 and Future Trends of the Implementation Technical Demands for Power Semiconductor Device Applications

Prof. Yamamoto Masayoshi
Nagoya University
Institute of Materials and Systems for Sustainability (IMaSS)
Professor

Jun. 13, 2024 (Thu.) 10:30 ~ 16:40

Seminar Venue D
NPI Presentation

Pre-Registration not required

10:30-10:50

Shadow Plus
A High Conductivity, Low Etch Amount and Highly Sustainability Direct Metallization Process

Mr. Albert Tseng
MacDermidalpha
Line of Business
Asia Product Manager

11:05-11:25

Electrolytic copper plating bath for high density penetrate through hole core board

Mr. Hironori Sugiura
C.Uyemura & Co.,Ltd.
Central Research Laboratory Research and Development Division
Senior researcher

11:40-12:00

Introduction of Shibuya's laser ablation processing machine and FPC and PCB processing examples.

Mr. SUWA TAKAYUKI
SHIBUYA CORPORATION
SPECIALIZED MACHINE SALES DIVISION
SALES MANAGER

12:15-12:35

Achieve Ultra-Low Power Operation!
Introducing the Bluetooth Virtual Mesh Network.

Mr. Oba Yoshimasa
NAITO DENSEI MACHIDA MFG.CO.,LTD.
Sales Dept.
MANAGER

12:50-13:10

The new era of PCB depaneling - LPKF laser depaneling technology seminar

Mr. Kamidate Hiroyuki
LPKF Laser&Electronics K.K.
Technical Sales
Sales Director

13:25-13:45

Solution for Contamination Defect in PCB/SMT manufactureing
~Fundamentals for reliable and safe cleaning for small contaminartion less than 100µm~

Ms. Tomomi Shinohara
BRUX JAPAN CO., LTD.

14:00-14:20

Example of high-speed, high-resolution elemental map analysis of electronic components using Unity, an innovative detector that simultaneously detects reflected electrons and X-rays

Mr. Makoto Ikarashi
Oxford Instruments KK
NanoAnalysis

15:10-15:30

Characterization of materials on electric devices using combined analysis of thermal analysis, rheology, and more.

Dr. Yuki Kawata
TA Instruments Japan
Application Team

15:45-16:05

New approach to SMT reflow from IBL, Germany

Mr. Takahisa Oshita
Techno Alpha.Co.LTD

16:20-16:40

High-density advanced PKG has become a reality! Introduction of excimer laser processing system Exa-Ms5 that enables ultra-fine via processing Φ3um, and the ultimate direct exposure device GDi-MPv2.

Mr. jin sato
ORC MANUFACTURING CO., LTD.

Jun. 13, 2024 (Thu.) 11:30 ~ 12:20

Seminar Venue A: Keynote
Keynote

Pre-Registration required

Admission Fee required

11:30-12:20

Advanced Heterogeneous Integration Platform for Next Generation Computing "Road to Beyond Moore"

Takashi Kariya
Samsung Japan Corporation
Samsung Device Solutions R&D Japan, Advanced Package Lab
Corporate Vice President / Head of Lab

Jun. 13, 2024 (Thu.) 11:35 ~ 12:25

Seminar Venue F
Smart Sensing/Automated Solution Exhibition /Edge Computing Keynote

Pre-Registration required

11:35-12:25

The Supply Chain of the Vibration Power Generator 'V-GENERATOR'

Mr. Shota Kita
Kanazawa University

11:35-12:25

The Supply Chain of the Vibration Power Generator 'V-GENERATOR'

Dr. Kiyoshi Izumi
Sumitomo Metal Mining Co., Ltd.

11:35-12:25

The Supply Chain of the Vibration Power Generator 'V-GENERATOR'

Mr. keisuke mine
Yokoyama Shokai Co., Ltd.

11:35-12:25

The Supply Chain of the Vibration Power Generator 'V-GENERATOR'

Mr. TOMOAKI SATO
YSHIMA ELECTRIC CO.,LTD.

Jun. 13, 2024 (Thu.) 11:45 ~ 16:00

Seminar Venue H
PROTEC Seminar

11:45-12:30

Evolution of Edge Machine to Achieve Autonomous Factory~Auto Setting Feeder~

Mr. Isobata Yoshinori
Panasonic Connect Co., Ltd.
Process Automation Business Division Circuit Formation Processes Coordination Department Floor Automation Development Department
Senior Manager

12:55-13:40

2024 Useful solder printing process technology for actual production

Mr. Wakabayashi Toshimasa
YAMAHA MOTOR CO.,LTD.

14:05-14:50

At the forefront of smart factories
Proposing an integrated solution from parts management to post-process

Mr. Togo Matsuura
JUKI automation systems corporation

15:15-16:00

The contribution Fuji pick and place machines make to surface mounting technology and the improvement and reform of production sites

Mr. Yamakage Yusuke
FUJI CORPORATION
Robotic Solutions Division NXTR Project
Project Leader

Jun. 13, 2024 (Thu.) 12:45 ~ 13:25

Seminar Venue F
Smart Sensing Exhibitor Presentation

Pre-Registration required

12:45-13:25

IR LEDs for Sensing Applications

Mr. Kumar Murali
Luminus Devices (presented by MARUBUN)
Non-Visible Products
Business Line Director

Jun. 13, 2024 (Thu.) 13:00 ~ 14:40

Seminar Venue E
Academic Plaza

Pre-Registration not required

13:00-13:20

Low temperature precision solid phase bonding of electronic packaging materials by metal salt generation bonding method

Shinji KOYAMA
Faculty of Science and Engineering, Gunma University

13:20-13:40

Chemically Control of Low-temperature Sintering Behavior and Interfacial Properties with Copper Electrodes of Silver Micro-flakes-filled Electrically Conductive Adhesives

Takanori Fukushima
Graduate School of Science and Technology, Gunma University

13:20-13:40

Chemically Control of Low-temperature Sintering Behavior and Interfacial Properties with Copper Electrodes of Silver Micro-flakes-filled Electrically Conductive Adhesives

Masahiro Inoue

Graduate School of Science and Technology, Gunma University

13:40-14:00

Enhancement of Electrical Reliability of Copper-filled Conductive Pastes by the Oxidation Tolerance Design

Masahiro Inoue
Graduate School of Science and Technology

13:40-14:00

Enhancement of Electrical Reliability of Copper-filled Conductive Pastes by the Oxidation Tolerance Design

Yukari Matsunami

Graduate School of Science and Technology

13:40-14:00

Enhancement of Electrical Reliability of Copper-filled Conductive Pastes by the Oxidation Tolerance Design

Daisuke Otajima

Graduate School of Science and Technology

14:00-14:20

Characterization of Bond Interface and Strength Measurement for Hybrid Bonding

Yusuke Kondo
Yokohama National University

14:00-14:20

Characterization of Bond Interface and Strength Measurement for Hybrid Bonding

Junya Fuse

Yokohama National University

14:00-14:20

Characterization of Bond Interface and Strength Measurement for Hybrid Bonding

Yuki Yoshihara

Yokohama National University

14:00-14:20

Characterization of Bond Interface and Strength Measurement for Hybrid Bonding

Tomoya Iwata

Yokohama National University

14:00-14:20

Characterization of Bond Interface and Strength Measurement for Hybrid Bonding

Marie Sano

Yokohama National University

14:00-14:20

Characterization of Bond Interface and Strength Measurement for Hybrid Bonding

Fumihiro Inoue

Yokohama National University

14:20-14:40

Low-temperature sintering of copper particle system enabling high-strength bonding.

Tetsu Yonezawa
Yonezawa Lab., Faculty of Engineering, Hokkaido Univ.

14:20-14:40

Low-temperature sintering of copper particle system enabling high-strength bonding.

Takashi Aso

Yonezawa Lab., Faculty of Engineering, Hokkaido Univ.

14:20-14:40

Low-temperature sintering of copper particle system enabling high-strength bonding.

Hiroki Tsukamoto

Yonezawa Lab., Faculty of Engineering, Hokkaido Univ.

Jun. 13, 2024 (Thu.) 13:00 ~ 15:50

Seminar Venue C

Jun. 13, 2024 (Thu.) 13:30 ~ 14:30

Seminar Venue B
　

Pre-Registration not required

Jun. 13, 2024 (Thu.) 13:30 ~ 16:00

JEIP Symposium A
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 13, 2024 (Thu.) 13:30 ~ 16:00

JEIP Symposium B
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 13, 2024 (Thu.) 13:45 ~ 14:35

Seminar Venue F
Smart Sensing/Automated Solution Exhibition /Edge Computing Keynote

Pre-Registration required

13:45-14:35

Mouser Show Case
~AI-oriented ingenious devices~

Ph.D. industry-leading suppliers Mouser Electronics &
Mouser Electronics, Nisshinobo Microdivices, Nippon Chemicon, Torex Semiconductor, Würth Elektronik,

13:45-14:35

Mouser Show Case
~AI-oriented ingenious devices~

Wurth Electronics Japan

13:45-14:35

Mouser Show Case
~AI-oriented ingenious devices~

Nisshinbo Micro Devices Inc.

13:45-14:35

Mouser Show Case
~AI-oriented ingenious devices~

Nippon Chemi-Con Corporation

13:45-14:35

Mouser Show Case
~AI-oriented ingenious devices~

TOREX SEMICONDUCTOR LTD

Jun. 13, 2024 (Thu.) 15:00 ~ 15:30

Seminar Venue F
Pre-Registration not required

Jun. 13, 2024 (Thu.) 15:00 ~ 16:15

Seminar Venue B
Seminar

Pre-Registration not required

Jun. 13, 2024 (Thu.) 15:00 ~ 17:00

Seminar Venue E
Academic Plaza

Pre-Registration not required

15:00-15:20

Effects of Addition a Small Amount of Quaternary Ammonium Salts to Aluminum Electrodeposition in Deep Eutectic Solvents

Tatsuya Iwabuchi
Koiwa Lab., Graduate School of Engineering, Kanto Gakuin Univ.

15:00-15:20

Effects of Addition a Small Amount of Quaternary Ammonium Salts to Aluminum Electrodeposition in Deep Eutectic Solvents

Takeshi Ohyama

15:00-15:20

Effects of Addition a Small Amount of Quaternary Ammonium Salts to Aluminum Electrodeposition in Deep Eutectic Solvents

Yuki Yatagawa

15:20-15:40

Selective deposition of electroless copper plating on electroless nickel-phosphorus thin films selectively deposited by UV irradiation

Itsuki Ozawa
Koiwa Lab., Graduate School of Engineering Kanto Gakuin Univ.

15:20-15:40

Selective deposition of electroless copper plating on electroless nickel-phosphorus thin films selectively deposited by UV irradiation

Yu-ki Hosoda

15:20-15:40

Selective deposition of electroless copper plating on electroless nickel-phosphorus thin films selectively deposited by UV irradiation

Japan Kanigen Co., Ltd.

15:40-16:00

Conversion of Polysilazane into Silica for Wafer Bonding at Room Temperature

Kai Takeuchi
Tohoku University

15:40-16:00

Conversion of Polysilazane into Silica for Wafer Bonding at Room Temperature

Daiki Nemoto

Tohoku University

15:40-16:00

Conversion of Polysilazane into Silica for Wafer Bonding at Room Temperature

Eiji Higurashi

Tohoku University

16:00-16:20

Prediction of blind via hole quality based on ensemble learning for laser drilling condition of printed circuit boards.

Soma Nowatari
Doshisha University graduate student

16:00-16:20

Prediction of blind via hole quality based on ensemble learning for laser drilling condition of printed circuit boards.

Takuto Fujimoto

Doshisha University graduate student

16:00-16:20

Prediction of blind via hole quality based on ensemble learning for laser drilling condition of printed circuit boards.

Masao Nakagawa
Doshisha University

16:00-16:20

Prediction of blind via hole quality based on ensemble learning for laser drilling condition of printed circuit boards.

Toshiki Hirogaki

Doshisha University

16:00-16:20

Prediction of blind via hole quality based on ensemble learning for laser drilling condition of printed circuit boards.

Eiichi Aoyama

Doshisha University

16:20-16:40

Construction and analysis of a support system for setting cutting conditions of PCB drills by machine learning of carbide drill catalog data

Kenta Chitose
Doshisha University graduate student

16:40-17:00

Direct Adhesion base on Plasma-Induced Surface Modification for Next Generation PCB Manufacturing

Tsuyoshi KOIZUMI
DENSHIGIKEN Co.,Ltd.

16:40-17:00

Direct Adhesion base on Plasma-Induced Surface Modification for Next Generation PCB Manufacturing

Osaka Research Institute of Industrial Science and Technology

16:40-17:00

Direct Adhesion base on Plasma-Induced Surface Modification for Next Generation PCB Manufacturing

Osaka Research Institute of Industrial Science and Technology

Jun. 14, 2024 (Fri.) 10:15 ~ 11:05

Seminar Venue F
　

Pre-Registration required

10:15-11:05

Future Prospects of Odor Sensors -Society will change with odor sensors

Mr. Genki Yoshikawa
National Institute for Materials Science (NIMS)

10:15-11:05

Future Prospects of Odor Sensors -Society will change with odor sensors

Mr. Gaku Imamura
Qception

10:15-11:05

Future Prospects of Odor Sensors -Society will change with odor sensors

Mr. Shunichiro Kuroki
Aroma Bit, Inc.
Founder & Representative Director & CEO

Jun. 14, 2024 (Fri.) 10:15 ~ 12:15

Seminar Venue E
3D-MID

Pre-Registration not required

Jun. 14, 2024 (Fri.) 10:15 ~ 12:45

JEIP Symposium A
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 14, 2024 (Fri.) 10:15 ~ 12:45

JEIP Symposium B
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 14, 2024 (Fri.) 10:30 ~ 11:15

Seminar Venue C
Pre-Registration not required

10:30-11:15

Application of "Process Informatics (PI)" as a DX strategy for the effective utilization of prototype, production, and evaluation data in manufacturing industries

Mr. Takaishi Masaki
Aixtal Corporation

Jun. 14, 2024 (Fri.) 10:30 ~ 11:20

Seminar Venue A: Keynote
Keynote

Pre-Registration required

Admission Fee required

10:30-11:20

Accelerating Towards the Future: Rapidus Semiconductor Back-End Strategy

Ph.D. Yasumitsu Orii
Rapidus Corporation
3D Assembly Division
Senior Managing Executive Officer

Jun. 14, 2024 (Fri.) 10:30 ~ 11:20

Seminar Venue G
JISSO PROTEC Special Session

Pre-Registration required

10:30-11:20

JEITA Japan Jisso Technology Roadmap 2024 - Latest trends of SMT equipment -

Mr. Tadashi Maeda
Japan Jisso Technology Roadmap Committee in JEITA
SMT equipment WG (WG6)
Leader

Panasonic Connect Co., Ltd.

Jun. 14, 2024 (Fri.) 10:30 ~ 16:40

Seminar Venue D
NPI Presentation

Pre-Registration not required

10:30-10:50

Additive for rough surface copper film on lead frames for power devices "TOP CLUSTER AR"

Mr. TAIKI KONO
Okuno Chemical Industries Co., Ltd.
Advanced R&D laboratories, Metal Finishing

11:05-11:25

V Technology’s IT solutions for the manufacturing industry

Mr. Ishikawa Hiroki
V Technology Co., Ltd.
New Business Promotion Headquarter

11:40-12:00

Introduction of despensing technology for large boards and tall components.

Mr. Takashi Kamikubo
Musashi Engineering, INC.
Marketing Strategy Division
Section Manager

12:15-12:35

The latest technical information for PCB tools.

Mr. Hoshi Yukiyoshi
UNION TOOL CO.

12:50-13:10

Total support for social implementation of 3D-MID/PE and the decarbonization in the electronic board field with IH reflow technology

Mr. Fukuda Koki
WonderFutureCorporation
CEO

13:25-13:45

N/A

Mr. imawaka naoto
N/A

14:00-14:20

How to effectively use thermal simulation tools to help front-loading thermal design

Mr. Shingo Tokunaga
IDAJ Co., LTD.
Modeling Solution Dept.2, Simulation Technology 4

14:35-14:55

Live Demonstration of Ontec's In-House Developed AI Tool for Automated PCB Layout!!

Mr. toku shoichiro
ONTEC CO.,LTD.

15:10-15:30

New era of PCB transfer ! : Lightweight, flexible, efficiency gripper from Schmalz

Mr. Wataru Yamabe
Schmalz K.K.

15:45-16:05

Palladium Catalyzed Aluminum Foil Prompts Innovation in Ultra-Fine and High-Frequency Packaging Substrates(A-SAP Technology)

Mr. Ryo Yano
Toyo Aluminium K.K.

16:20-16:40

RDL Embedded Coreless Substrate (Organic Interposer) for Heterogeneous Integration

Mr. Fusao Takagi
TOPPAN Inc.
Advanced Semiconductor Packaging Development Center, Electronics Division
Manager

Jun. 14, 2024 (Fri.) 11:30 ~ 12:20

Seminar Venue A: Keynote
Keynote

Pre-Registration required

Admission Fee required

11:30-12:20

The Future of AI and Robotics Fusion ~ Vision of Next-Generation Robots ~

Prof. Tetsuya Ogata
Waseda University
Institute for AI and Robotics
Director

Jun. 14, 2024 (Fri.) 11:35 ~ 12:25

Seminar Venue F
Smart Sensing/Automated Solution Exhibition /Edge Computing Keynote

Pre-Registration required

11:35-12:25

The value of sensors is drastically changing with generative AI

Mr. Satoshi Ueno
MODE, Inc.
Vice President of Business

Jun. 14, 2024 (Fri.) 11:45 ~ 16:00

Seminar Venue H
PROTEC Seminar

11:45-12:30

The contribution Fuji automation makes to SMT lines that do not stop and the improvement and reform of production sites

Mr. Morita Yukitoshi
FUJI CORPORATION
Robotic Solutions Division Smart Factory Development
Department Manager

12:55-13:40

2024 Useful solder printing process technology for actual production

Mr. Wakabayashi Toshimasa
YAMAHA MOTOR CO.,LTD.

14:05-14:50

Evolution of Edge Machine to Achieve Autonomous Factory~Auto Setting Feeder~

Mr. Isobata Yoshinori
Panasonic Connect Co., Ltd.
Process Automation Business Division Circuit Formation Processes Coordination Department Floor Automation Development Department
Senior Manager

15:15-16:00

Expectation for carbon neutralized, environmental friendly manufacturing with Sn-Bi base low temperature solder and introduction of low temperature wave soldering technology

Mr. Takahiro Matsufuji
SENJU METAL INDUSTRY Co.,Ltd.

Jun. 14, 2024 (Fri.) 12:30 ~ 13:20

Seminar Venue A: Keynote
Keynote

Pre-Registration required

Admission Fee required

12:30-13:20

Challenges on automotive E/E systems required for Software Devined Vehicles

Mr. Takeshi Mitamura
Hitachi Astemo, Ltd.
SDV Platform Functional Division, Electrification Business Division
Senior Vice President, Head of SDV Platform Functional Division

Jun. 14, 2024 (Fri.) 12:30 ~ 14:45

Seminar Venue B
Pre-Registration not required

Jun. 14, 2024 (Fri.) 12:45 ~ 13:25

Seminar Venue F
Smart Sensing Exhibitor Presentation

Pre-Registration required

Jun. 14, 2024 (Fri.) 13:00 ~ 14:40

Seminar Venue E
Academic Plaza

Pre-Registration not required

13:00-13:20

Similarity Region Extraction in Electrical Circuits Using Graph Neural Networks (GNN)

Hiroki Yonekura
Osaka Electro-Communication University

13:00-13:20

Similarity Region Extraction in Electrical Circuits Using Graph Neural Networks (GNN)

Tomio Echigo

Osaka Electro-Communication University

13:20-13:40

Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

Futo Kurose
Ehime University

13:20-13:40

Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

Tatsuya Nishikawa

Ehime University

13:20-13:40

Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

Shaoqi Wei

Ehime University

13:20-13:40

Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

Senling Wang

Ehime University

13:20-13:40

Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

Shuichi Kameyama

Ehime University

13:20-13:40

Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

Hiroshi Kai

Ehime University

13:20-13:40

Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

Hiroshi Takahashi

Ehime University

13:20-13:40

Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

Kazuya Okada
TAKAYA Corporation

13:20-13:40

Acceleration of Flying-Probe Testing using Deep Graph Neural Networks and Reinforcement Learning

Koki Yanagida

TAKAYA Corporation

13:40-14:00

Development of Boundary Scan Design for Automatic Interconnect Testing of Stand-by Mode ICs and its System Controller

Haruhisa Tsuruoka
Tokushima University

13:40-14:00

Development of Boundary Scan Design for Automatic Interconnect Testing of Stand-by Mode ICs and its System Controller

Hiroyuki Yotsuyanagi
Tokushima University

13:40-14:00

Development of Boundary Scan Design for Automatic Interconnect Testing of Stand-by Mode ICs and its System Controller

Masaki Hashizume
The Open University of Japan

14:00-14:20

Proposal of Visualization and High-Speed Quality Assurance Techniques for Passing Flow between Fins to Elucidate the Mechanism of Air Cooling Performance Improvement of Lotus Corrugated Fins

Ryohei Kubota
Sanyo-Onoda City University

14:00-14:20

Proposal of Visualization and High-Speed Quality Assurance Techniques for Passing Flow between Fins to Elucidate the Mechanism of Air Cooling Performance Improvement of Lotus Corrugated Fins

Kohei Yuki

Sanyo-Onoda City University

14:00-14:20

Proposal of Visualization and High-Speed Quality Assurance Techniques for Passing Flow between Fins to Elucidate the Mechanism of Air Cooling Performance Improvement of Lotus Corrugated Fins

Kazuhisa Yuki

Sanyo-Onoda City University

14:00-14:20

Proposal of Visualization and High-Speed Quality Assurance Techniques for Passing Flow between Fins to Elucidate the Mechanism of Air Cooling Performance Improvement of Lotus Corrugated Fins

Tetsuro Ogushi
Lotus Thermal Solution, Inc

14:00-14:20

Proposal of Visualization and High-Speed Quality Assurance Techniques for Passing Flow between Fins to Elucidate the Mechanism of Air Cooling Performance Improvement of Lotus Corrugated Fins

Masaaki Murakami

Lotus Thermal Solution, Inc

14:00-14:20

Proposal of Visualization and High-Speed Quality Assurance Techniques for Passing Flow between Fins to Elucidate the Mechanism of Air Cooling Performance Improvement of Lotus Corrugated Fins

Tomiyuki Numata

Lotus Thermal Solution, Inc

14:00-14:20

Proposal of Visualization and High-Speed Quality Assurance Techniques for Passing Flow between Fins to Elucidate the Mechanism of Air Cooling Performance Improvement of Lotus Corrugated Fins

Takuya Ide

Lotus Thermal Solution, Inc

14:20-14:40

Development of a System to Notice Warning Sounds with Deep Learning for the Deaf and Hard of Hearing

Takeru MAKIUCHI
National Institute of Technology (KOSEN), Nagano College

14:20-14:40

Development of a System to Notice Warning Sounds with Deep Learning for the Deaf and Hard of Hearing

Hidetoshi NAKAYAMA

National Institute of Technology (KOSEN), Nagano College

14:20-14:40

Development of a System to Notice Warning Sounds with Deep Learning for the Deaf and Hard of Hearing

Ayana RIKIMARU

National Institute of Technology (KOSEN), Nagano College

14:20-14:40

Development of a System to Notice Warning Sounds with Deep Learning for the Deaf and Hard of Hearing

Hideto TANAKA

National Institute of Technology (KOSEN), Nagano College

14:20-14:40

Development of a System to Notice Warning Sounds with Deep Learning for the Deaf and Hard of Hearing

Mitsunari KITAYAMA

National Institute of Technology (KOSEN), Nagano College

Jun. 14, 2024 (Fri.) 13:00 ~ 16:05

Seminar Venue C

Jun. 14, 2024 (Fri.) 13:30 ~ 16:00

JEIP Symposium A
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 14, 2024 (Fri.) 13:30 ~ 16:00

JEIP Symposium B
JIEP Symposium

Pre-Registration required

Admission Fee required

Jun. 14, 2024 (Fri.) 13:45 ~ 14:25

Seminar Venue F
Smart Sensing Exhibitor Presentation

Pre-Registration required

13:45-14:25

IoT RF Device for Sensing

Mr. Egawa Shoho
Digi International K.K.

Jun. 14, 2024 (Fri.) 15:00 ~ 16:40

Seminar Venue E
Academic Plaza

Pre-Registration not required

15:00-15:20

Development of a Neural Network Model for Bipedal Gait Control Capable of Switching Gait and Crossing Over Obstacles

Tatsumi Goto
Nihon University / Micro Design Laboratory

15:00-15:20

Development of a Neural Network Model for Bipedal Gait Control Capable of Switching Gait and Crossing Over Obstacles

Rina Okamoto

Nihon University / Micro Design Laboratory

15:00-15:20

Development of a Neural Network Model for Bipedal Gait Control Capable of Switching Gait and Crossing Over Obstacles

Takumi Ishihama

Nihon University / Micro Design Laboratory

15:00-15:20

Development of a Neural Network Model for Bipedal Gait Control Capable of Switching Gait and Crossing Over Obstacles

Kentaro Yamazaki

Nihon University / Micro Design Laboratory

15:00-15:20

Development of a Neural Network Model for Bipedal Gait Control Capable of Switching Gait and Crossing Over Obstacles

Yugo Kokubun

Nihon University / Micro Design Laboratory

15:00-15:20

Development of a Neural Network Model for Bipedal Gait Control Capable of Switching Gait and Crossing Over Obstacles

Minami Kaneko

Nihon University / Micro Design Laboratory

15:00-15:20

Development of a Neural Network Model for Bipedal Gait Control Capable of Switching Gait and Crossing Over Obstacles

Fumio Uchikoba

Nihon University / Micro Design Laboratory

15:20-15:40

Dynamics Analysis of Walking for Practical Application of MEMS Micro Robots

Misaki Takaku
Micro Design Laboratory, Nihon University

15:20-15:40

Dynamics Analysis of Walking for Practical Application of MEMS Micro Robots

Yifan Yang

Micro Design Laboratory, Nihon University

15:20-15:40

Dynamics Analysis of Walking for Practical Application of MEMS Micro Robots

Minami Kaneko

Micro Design Laboratory, Nihon University

15:20-15:40

Dynamics Analysis of Walking for Practical Application of MEMS Micro Robots

Fumio Uchikoba

Micro Design Laboratory, Nihon University

15:40-16:00

Development of Endoscope-Connected MEMS Microrobot Driven by Compressed Pressurized Gas

Takamichi Funakoshi
Nihon University Micro Design Laboratory

15:40-16:00

Development of Endoscope-Connected MEMS Microrobot Driven by Compressed Pressurized Gas

Yifan Yang

Nihon University Micro Design Laboratory

15:40-16:00

Development of Endoscope-Connected MEMS Microrobot Driven by Compressed Pressurized Gas

Misaki Takaku

Nihon University Micro Design Laboratory

15:40-16:00

Development of Endoscope-Connected MEMS Microrobot Driven by Compressed Pressurized Gas

Minami Kaneko

Nihon University Micro Design Laboratory

15:40-16:00

Development of Endoscope-Connected MEMS Microrobot Driven by Compressed Pressurized Gas

Fumio Uchikoba

Nihon University Micro Design Laboratory

16:00-16:20

Development of an Ultra-Compact MEMS Vapor Chamber that Suppresses Temperature Rise in Electronic Devices

Chihiro Sakamoto
Nihon University Micro Design Laboratory

16:00-16:20

Development of an Ultra-Compact MEMS Vapor Chamber that Suppresses Temperature Rise in Electronic Devices

Toui Yukishita

Nihon University Micro Design Laboratory

16:00-16:20

Development of an Ultra-Compact MEMS Vapor Chamber that Suppresses Temperature Rise in Electronic Devices

Yuya Niki

Nihon University Micro Design Laboratory

16:00-16:20

Development of an Ultra-Compact MEMS Vapor Chamber that Suppresses Temperature Rise in Electronic Devices

Fumio Uchikoba

Nihon University Micro Design Laboratory

16:00-16:20

Development of an Ultra-Compact MEMS Vapor Chamber that Suppresses Temperature Rise in Electronic Devices

Minami Kaneko

Nihon University Micro Design Laboratory

16:20-16:40

Development of Rotary-Type Electrostatic Motor for MEMS Microrobot

Shuxin Lyu
Department of Precision Machinery Engineering, Graduate School of Science and Technology, Nihon University

16:20-16:40

Development of Rotary-Type Electrostatic Motor for MEMS Microrobot

Yudai Tominaga

Department of Precision Machinery Engineering, Graduate School of Science and Technology, Nihon University

16:20-16:40

Development of Rotary-Type Electrostatic Motor for MEMS Microrobot

Yuya Tamaki

Department of Precision Machinery Engineering, Graduate School of Science and Technology, Nihon University

16:20-16:40

Development of Rotary-Type Electrostatic Motor for MEMS Microrobot

Department of Precision Machinery Engineering, College of Science and Technology, Nihon University

Jun. 14, 2024 (Fri.) 15:00 ~ 16:45

Seminar Venue I
PWB Consultant Skill up Seminar

Pre-Registration required

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