| Exhibition | : | SURTECH 2026 |
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| Booth | : | 3S-C21 |
| Venue | : | SURTECH Seminar(South hall 4) |
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A Novel Dry and Material-Independent Plasma Surface Modification Method
We have developed a unique low-temperature nonequilibrium plasma technology capable of imparting superhydrophobic functionality to a wide range of materials. Unlike conventional coating or chemical treatment, this technology enables molecular-level surface modification, making it effective not only for metals, glass, ceramics, and common polymers but also for difficult-to-process fluoropolymers. As a dry process that requires no chemical solutions, it reduces environmental impact and supports sustainable manufacturing. Applications extend across many industries, including waterproofing and moisture protection of electronic devices, liquid control in medical and bio fields, and antifouling or corrosion prevention in transportation and construction. In this seminar, we will introduce real processed samples and discuss the technology’s advantages for practical implementation in manufacturing.
| Venue | : | SURTECH Seminar(South hall 4) |
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A High-Adhesion Plasma Process Unlocking New Manufacturing Possibilities for Hard-to-Bond Materials
Fluoropolymers are widely used due to their excellent chemical resistance and low friction, yet their extremely low surface energy makes adhesion and bonding highly challenging. We have developed a proprietary low-temperature nonequilibrium plasma technology that enables significant adhesion enhancement on fluoropolymer surfaces without the use of chemical solutions. This process achieves molecular-level surface modification within a short time, and has demonstrated improved adhesion to various materials such as metals, polymers, and coating agents. The technology contributes to simplified manufacturing processes and improved product reliability in fields including electronics, medical devices, and transportation. In this seminar, we will present the modification mechanism and industrial application examples of this high-adhesion plasma process.
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| Company | : | SAKIGAKE-Semiconductor |
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| Address | : | SAKIGAKE Building 50 Nishishichijo Omaeda-cho Shimogyo-ku, Kyoto-shi Kyoto, Japan, Kyoto Japan 600-8897 |