A High-Adhesion Plasma Process Unlocking New Manufacturing Possibilities for Hard-to-Bond Materials

SAKIGAKE Semiconductor Co., Ltd.

Ms. Mina Tomikawa

Fluoropolymers are widely used due to their excellent chemical resistance and low friction, yet their extremely low surface energy makes adhesion and bonding highly challenging. We have developed a proprietary low-temperature nonequilibrium plasma technology that enables significant adhesion enhancement on fluoropolymer surfaces without the use of chemical solutions. This process achieves molecular-level surface modification within a short time, and has demonstrated improved adhesion to various materials such as metals, polymers, and coating agents. The technology contributes to simplified manufacturing processes and improved product reliability in fields including electronics, medical devices, and transportation. In this seminar, we will present the modification mechanism and industrial application examples of this high-adhesion plasma process.