| Exhibition | : | nano tech 2026 |
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| Booth | : | AT-K07-01 |
| Zone | : | Others: Organizer Special Exhibition |
| Pavilion | : | Startup&University Lab Pavilion |
Labor saving / Automation / Optimization, Productivity enhancement
Pitch sessions by startups and university research labs!
These sessions foster new business opportunities and problem-solving, accelerating open innovation.We hope you will join us
| Venue | : | Seeds & Needs Seminar B(West hall 1) |
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| Venue | : | Seeds & Needs Seminar B(West hall 1) |
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A next-generation coating technology enabling precise nano-surface control through high-precision spraying with minimal material loss.
For several decades, we have contributed to the advancement of coating technologies by obtaining multiple patents related to conformal coating of electronic substrates and thin-film deposition of functional materials in the semiconductor field. We now present a new coating process in the nano-coating domain.
By applying electrostatic charging to coatings atomized through a swirling airflow generated by a specially machined star-shaped air cap nozzle, excellent coverage is achieved, even on complex surfaces and edges with undercuts. Electrostatic application of various functional liquids, combined with a swirling circular spray pattern, enables the formation of electrostatically charged fine droplets, resulting in nano-order thin-film deposition.
| Venue | : | Seeds & Needs Seminar B(West hall 1) |
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| Venue | : | Seeds & Needs Seminar B(West hall 1) |
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NanoFrontier Inc. is a university spin-off founded in 2025 based on nanoparticle engineering technologies developed at Tohoku University. This presentation introduces our approach to building a sustainable society through scalable nanoparticle technologies.
As AI and data centers rapidly expand, energy consumption and heat dissipation have become major challenges. NanoFrontier develops high-performance nanofluids that enhance heat transfer by disrupting thermal boundary layers, enabling more efficient immersion cooling. Our nanoparticle platform also extends to applications in environmental sensing, energy storage, catalysis, and pharmaceuticals, demonstrating how deep-tech innovation can be translated into practical sustainability solutions.
| Venue | : | Seeds & Needs Seminar B(West hall 1) |
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Graduated from the Department of Applied Chemistry, Faculty of Engineering, The University of Tokyo in 2025, and currently pursuing graduate studies in the Department of Applied Chemistry at the Graduate School of Engineering, The University of Tokyo. Selected for multiple acceleration programs, including the JST Sogyo (Early-Startup) Program, ANRI STARTLINE, and NEDO NEP (Exploration Course), working on the commercialization of MOF-based analytical and separation technologies.
We are a team at the University of Tokyo (Uemura Laboratory) developing and commercializing a new chromatography technology called "MOFgraphy." MOFgraphy is a next-generation chromatography platform based on metal-organic frameworks (MOFs)-a class of porous coordination polymers that received the 2025 Nobel Prize in Chemistry.
In this session, we will present our initial studies demonstrating the ability of MOFs as stationary phases to distinguish subtle differences in polymer chain architectures - such as end-group functionalities and cyclic versus linear structures - which have been difficult or impossible to separate using conventional chromatography, as well as comparative performance data against existing commercial columns. We are seeking partners for joint research and proof of concept (PoC) studies aimed at advancing purification processes for peptide and polymer-based therapeutics, as well as functional polymers.
| Venue | : | Seeds & Needs Seminar B(West hall 1) |
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--- Ball SAW Sensors for Trace Gas, Moisture, and AMC Monitoring
He received his Ph.D. in Engineering from the Graduate School of Engineering, Tohoku University, in 1985. After serving as an executive at a U.S. startup company and working as an industry-academia-government collaborative researcher at Tohoku University, he has been engaged in research and development of MEMS and ball SAW sensors. Since 2016, he has held his current position. His current work focuses on the development of ultra-compact gas chromatographs, trace moisture analyzers based on ball SAW sensors, and gas analysis and monitoring technologies for semiconductor manufacturing and bioprocess applications.
In advanced manufacturing processes such as semiconductor fabrication, even trace amounts of impurities and airborne molecular contaminants (AMCs) can seriously affect product quality and yield. In pharmaceutical and food manufacturing using bioreactors, non-invasive monitoring technologies are also important to understand reaction processes without influencing the reaction system.
This presentation introduces Ball SAW sensor technology, which utilizes surface acoustic waves that propagate around the equator of a sphere without diffraction. This technology is characterized by a compact size, high sensitivity, and fast response, enabling in-situ and on-site measurement of trace moisture in gases, volatile organic compounds (VOCs), and AMCs at ppb to ppm levels.
Through applications in quality control at semiconductor manufacturing sites and in continuous analysis of bioreactor exhaust gases, the potential for application across a wide range of manufacturing fields is demonstrated.
| Venue | : | Seeds & Needs Seminar B(West hall 1) |
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| Venue | : | Seeds & Needs Seminar B(West hall 1) |
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| Venue | : | Seeds & Needs Seminar B(West hall 1) |
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Any mirror-polished material substrate can be bonded.
He has proposed and is currently engaged in research into atomic diffusion bonding, a room-temperature bonding technique. This technique, which enables bonding of any mirror-polished wafer or substrate, is gaining wider use for fabricating composite wafers and electrical devices. He received MEXT Award for Science and Technology (Research Category) in 2025.
We proposed atomic diffusion bonding (ADB) of two flat wafers (substrates) using thin inorganic films, which is a promising process to achieve room temperature bonding. This technique, which enables bonding of any mirror-polished wafer or substrate, is gaining wider use for fabricating composite wafers, optical and electrical devices. In addition to metal films, oxide, nitride and carbide films are useful for bonding. We expect that ADB opens a new path in fabricating new devices. We will present technology overview and applications of atomic diffusion bonding techniques.
*The following information is provided to enable inquiries to exhibitors.
Unauthorized use and reproduction for any other purpose is prohibited.
| Company | : |
The University of Tokyo
Uemura Lab |
|---|---|---|
| Address | : | Uemura Lab, 7C01 Engineering Building No.3, The University of Tokyo, Hongo Campus, 7-3-1 Hongo, Bunkyo-ku, Tokyo, Tokyo Japan 113-8656 |
| URL | : | https://uemuragroup.t.u-tokyo.ac.jp/en/ |