Kyushu University, Center of Plasma Nano-interface Engineering

Dr. Hakaru Mizoguchi

In this report, I will report about the history of lithography from DUV to new EUV re-search activity in Kyushu-Univ. in Japan. We have been planning EUV Exposure Research Center for support material development and also new high power EUV source investigation program has been on going.
Also third miniaturization: Recently miniaturerization of packaging is spotlighted in the semiconductor market. I report about extension of DUV Excimer laser for lithography to di-rect laser processing. And also I will report about New challenge; Hybrid Excimer laser sys-tem which is combination of Excimer laser and solid state laser for future processing.

FUJIFILM Corporation
Electronic Materials Research & Development Center
Senior Expert

Mr. Toru FUJIMORI

TORU FUJIMORI, is a Senior Expert at FUJIFILM Corporation, responsible for external collaboration and technical discussions. He received his B.S. and M.S. degrees in organic chemistry from Saitama University, Japan, in 1989 and 1991, respectively. In 1991, he joined FUJIFILM Corporation as a researcher in the synthetic organic chemistry laboratories.
He spent 3 years synthesizing new materials for photo films and then 8 years working on semiconductor materials (photo resist materials). In 2002, He moved to the electronic materials research laboratories to study color resist for image sensors for 6 years. Since 2008, he has been researching photo resist materials for KrF, ArF, ArF immersion, EB and EUV lithography as a research manager. From 2014 to 2016, he served as a senior researcher at EIDEC (EUVL Infrastructure Development Center, Inc.) on assignment from FUJIFILM.
He has filed over 200 patents in this field and authored numerous papers, presentations, and chapter in a photo resist text book.
He is a program committee member, head of Patterning Materials section of MNC, and a referee of ACS, JJAP, and other journals.

In 2019, extreme ultraviolet (EUV) lithography was applied to high volume manufacturing (HVM). With recent rapid progress in source power improvement and the development of EUV lithography, including photo resist materials, HVM requirements have been achieved. However, the performance of EUV resist materials is still not surfficient for the expected HVM requirements. The critical issue is the stochastic problems, which can result in defectivity, such as nano-bridges or a nano-breaks. The author classified 2 (two) kinds of stochastic issues in lithography, which are photon stochastic and chemical stochastic. The improvement status of each stochastic issue, including lithographic results, is described. Additionally, the future prospects of EUV resist materials will be discussed.

Tekscend Photomask Corp.
Global R&D
VP

Mr. Yosuke KOJIMA

Yosuke Kojima is a VP of Global R&D at Tekscend Photomask Corp. in Japan.
He received B.S. degree in applied physics and M.S. degree in frontier science from the university of Tokyo in 2001 and 2003 respectively.
In 2003 he joined Toppan Printing Co., Ltd. Since then he was active in various field of optical mask such as MoSi binary mask, high durability PSM and high resolution mask techniques.
In 2022 and 2023 he served as program committee chair of Photomask Japan.
Currently he is managing the research and development of material, process and tool technologies for both optical and EUV mask.

Photomask is master template used to
transfer circuits onto semiconductor wafer, making it indispensable component
in the semiconductor manufacturing process. This presentation will show key
technologies in the development of EUV mask, most advanced photomasks. It will
also introduce the positioning of the EUV mask market and provide future market
outlook.