Your expert and development partner in the field of smart systems and MEMS
Packaging technologies:
wafer and chip bonding
Parylene deposition
additive methods in packaging
electrochemical deposition of Al
MEMS and printed devices:
inertial sensors
optical devices
CMUT
printed humidity sensor
smart patch
MEMS-based systems:
optical quality monitoring of electroplating
fluid property sensor
gyrocompass
monitoring of soil and plants
heart failure implant
spheres for process monitoring in bioreactors
MEMS and packaging technologies
- processes for reactive and inductive bonding as well as bonding by Parylene
- Parylene deposition for layers combined with metallization and substrates for sensors and PCBs
- deposition technologies (electrochemical deposition for aluminum) and printing technologies (screen and aerosol jet printing) for packaging
- 3 D packaging cluster (deposition, pre and post treatment, Pick & Place)
MEMS and printed devices
- inertial sensors: high-precision acceleration sensors and gyroscopes
- optical devices: tunable Fabry-Pérot interferometer, MOEMS based on aluminum nitride
- capacitive micromachined ultrasonic transducer for medical devices, gas flow and chemical sensors
- printed humidity sensor based on nanoparticles
- smart patch manufactured by screen printing
MEMS-based systems
- optical quality monitoring system of electroplating solutions with short measurement times
- fluid property sensor for detection density and viscosity
- gyrocompass independent of magnetic fields and GPS connectivity
- low-cost sensors for monitoring of soil and plants
- implant for hemodynamic monitoring
- fully autarkic sensor spheres for process monitoring in bioreactors
Inductive bonding: A new bonding method in microsystems technology
2022-01-26_PressRelease_inductive-bonding_MSNS2022_FraunhoferENAS_EN.pdf
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Fraunhofer Institute for Electronic Nano Systems ENAS