PANAC

Booth: 6P-05
Exhibition: neo functional material 2022
Zone: Composite materials zone

Product 1
Product 2
Product 3
Product 4
Product 5
Product 6
Product 7
Product 8
Product 9

Product 1 New Product Pdf

Fuel Cell Water Resistance Adhesive

A Hot melt adhesive with long-term reliability over a wide range of temperature and humidity. It has excellent adhesion to a variety of substrates. Suitable for applications that require extreme durability, such as fuel cell applications and so on.


【Item No.1】Fuel Cells Water-Resistant Adhesive (AHMS).pdf
(Downloaded)

Product/technology Category
Materials
Adhesives/Adhesive Resins, PSA/Release Agents, Insulation Materials
Functional Film/Sheets
Films/Substrates, Adhesive/PSA Sheets, Release Films/Release Paper, Secondary Battery Components, Sealant Films
Device
Fuel Cell

Application Field
Automobile / Logistics / Transporting

Product 2

After-cured AR Hard-Coat Film for CID *developed by Nippon Paint Automotive Coatings Co., Ltd.

A low-reflection hard coated film for CID. Since it is after-cured, it can reproduce designs with complex shapes, making it suitable for high quality automotive interior panel applications.


Product/technology Category
Materials
Molding Resin Materials, Photocuring Materials, Optical Components
Functional Film/Sheets
Films/Substrates, Optical Film, Decorative Films/Release Films/Release Foil, Hard Coat Film
Device
Others

Product 3 Pdf

Foaming Resistance Optical Clear Adhesive

An adhesive with excellent foam resistance under high temperature and high humidity. Excellent adhesion reliability to PC and other plastics. The acid-free type is effective for bonding of optical components like touch sensors where corrosion is a concern.


【Item No.3】Forming Resistant Adhesive (PDB1&PDB2).pdf
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Product/technology Category
Materials
Adhesives/Adhesive Resins, PSA/Release Agents, Optical Components
Functional Film/Sheets
Optical Film, Adhesive/PSA Sheets, Release Films/Release Paper, Barrier Films
Device
Flexible Displays, Organic Electro Luminescence, Sensors (bio-sensors, vital sensors, environmental sensors), Wearable Devices

Product 4 Pdf

Protective Flim for Nanoimprint

A protective adhesive for optical films that shows sufficient adhesion to adherends with nano-order fine irregularities on the surface. It has low residue on the adherend after peeling.


【Item No.4】Low Residue Protective Film for Nanoimprint.pdf
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Product/technology Category
Functional Film/Sheets
Films/Substrates, Masking Film/Protect Film, Optical Film, Adhesive/PSA Sheets, Release Films/Release Paper, Anti-static films
Processing Technology
Nano-Imprint

Product 5 Pdf

High Hardness · Stress Relaxation Optical Clear Adhesive

PDHA1 (High Hardness OCA) has a very high storage modulus (2.1 vs. 6.6E05 MPa) compared to standard OCA, which means that it can be used in combination with HC films to provide a higher level of HC hardness.PDSO1 is an OCA with higher Tan-delta (0.3 vs. 1.9) and better stress relaxation properties than standard OCA. It also has an excellent adhesion to substrates with uneven or curved surfaces.


【Item No.5】High Hardness Acrylic Adhesive (PDHA1), Stress Relaxation Adhesive (PDSO1).pdf
(Downloaded)

Product/technology Category
Materials
Adhesives/Adhesive Resins, PSA/Release Agents, Optical Components
Functional Film/Sheets
Optical Film, Adhesive/PSA Sheets, Release Films/Release Paper, Decorative Films/Release Films/Release Foil
Device
Flexible Displays, Electronic Paper, Wearable Devices

Product 6 Pdf

Heat Resistance Protective Film for FPC

HRCHO3 is a heat resistance protective film which can be peeled off without leaving any adhesive residue on the adherend even after heat pressing process at 230°C, 3MPa, 2h x 4 times. Besides Adhesive type, tack-free type is also available.


【Item No.6】Heat Resistance Protective Film for FPC.pdf
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Product/technology Category
Functional Film/Sheets
Masking Film/Protect Film, Adhesive/PSA Sheets, Release Films/Release Paper
Processing Technology
Packaging Technology (solder, connectors)
Device
Sensors (bio-sensors, vital sensors, environmental sensors), Flexible Printed Circuits (FPC)

Product 7 Pdf

Switching Adhesive (Thermal Decomposition,Heat Release Type, UV Release Type)

Thermal or UV peeling type can hold the adherend firmly in place during the process, and can be lightly peeled off by thermal or UV load for easy removal. The thermal decomposition type has excellent thermal decomposition properties and can be used as process protection that disappears in the sintering process at 300-500°C.


【Item No.7】Heat Decomposition Adhesive (HD Adhesive).pdf
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Product/technology Category
Materials
Photocuring Materials
Functional Film/Sheets
Films/Substrates, Masking Film/Protect Film, Adhesive/PSA Sheets, Release Films/Release Paper
Device
Passive Components (capacitors, resistors, etc.), Others

Product 8 Pdf

FPC Components (Plating Film, Low Dielectric Adhesive)

We introduce various items related to FPC manufacturing process.


【Item No.9】Copper Plated Film (Panagrowth (COP)).pdf
(Downloaded)

Product/technology Category
Materials
Metal Foil, Flexible Printed Circuit (FPC), Adhesives/Adhesive Resins, PSA/Release Agents, Insulation Materials
Functional Film/Sheets
Films/Substrates, Masking Film/Protect Film, Adhesive/PSA Sheets, Release Films/Release Paper
Processing Technology
Packaging Technology (solder, connectors), Plating Technology, Photolithography/Etching Technology
Device
Memory (printed, MEMS, etc.), Wearable Devices, Flexible Printed Circuits (FPC), Smart Labels (RFID, sensors)

Product 9 Pdf

Anisotropic Conductive Adhesive

Functional materials consisting of various resin films (e.g. PET, PI, etc.) and metal foils (e.g. Cu, SUS, Al, etc.) can be produced and combined with this conductive adhesive by dry lamination.


【Item No.11】Anisotropic Conductive Adhesive (ACA).pdf
(Downloaded)

Product/technology Category
Materials
Metal Foil, Conductive Materials (conductive polymers, metal inks/pastes), Adhesives/Adhesive Resins, PSA/Release Agents
Functional Film/Sheets
Adhesive/PSA Sheets, Release Films/Release Paper, Conductive Film
Processing Technology
Coating Process, Laminating Process
Device
Organic Transistors, FHE (flexible hybrid electronics), Flexible Displays, Electronic Paper, Organic Electro Luminescence, Memory (printed, MEMS, etc.), Solar Battery, Sensors (bio-sensors, vital sensors, environmental sensors), Wearable Devices, Flexible Printed Circuits (FPC), Fuel Cell, Flexible Si Chips (MEMS, sensors, etc.), Smart Labels (RFID, sensors), Passive Components (capacitors, resistors, etc.)

Contact

*The following information is provided to enable inquiries to exhibitors.
Unauthorized use and reproduction for any other purpose is prohibited.

PANAC

5961-1 Kitayama, Fujinomiya City, Shizuoka Prefecture, Shizuoka Japan 4180112

TEL : 0544-58-8790
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