Fraunhofer ENAS

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Online Exhibitor
Exhibition: MEMS SENSING & NETWORK SYSTEM 2021

Exhibit Highlights

Fraunhofer ENAS: Your System and Technology Partner in Smart Systems Integration

Fraunhofer ENAS is your development partner in the field of Smart Systems and their integration for various applications. It has specialized on the challenge of combining micro and nano sensors, actuators and electronic components with interfaces for communication and a self-sufficient energy supply to form smart systems, thus supporting the Internet of Things and the ongoing digitalization.


Product 1
Product 2
Product 3

Product 1 Presentation Video PDF

Permanent wafer bonding techniques ba Fraunhofer ENAS

Permanent wafer bonding techniques are used in microelectronics and micromechanics to join thin, polished wafers made of different materials together - with or without additional intermediate layers.

General requirements::
Low temperatures (< 400 °C)
Material compatibility
Mechanical stability
Most cases: hermetic sealing
Minimized bonding frame width

Dr. Mario Baum
mario.baum@enas.fraunhofer.de


Waferbonding.pdf
Video

Product 2 Presentation New Product Video PDF

Piezoelectric actuators and sensors for medical technology

Microsystems based on piezoelectric aluminum nitride (AlN) offers the advantage of a high miniaturization potential. The technical developments include AlN-based microscanners with integrated position sensors for one or two-dimensional deflection of laser beams for application in high-precision, endoscopic systems for medical technology.

Katja Meinel
katja.meinel@enas-extern.fraunhofer.de


Piezoelectric_ActuatorsSensors_EN.pdf
Video

Product 3 Presentation Video

Ultra-thin and highly flexible PCB for tracking systems and wearables

An advanced, ultra-thin and highly flexible PCB of only 20 µm thickness.with multiple redistribution layers is presented. In the project Fraunhofer ENAS develops the flexible PCB of Parylene and MEMS with TSV.
The advantageous substrate properties are transparency, biocompatibility, and chemical stability to realize a versatile platform for flexible electronics.

franz.selbmann@enas.fraunhofer.de


Video

Product/technology Category
Fabrication Technology / Evaluation & Measurement / Analysis Technology & Tool
Microfabrication (front-end , etching , deposition , lithography etc.), Evaluation & Measurement / Analysis Technology & Tool, Printed electronics, Microfabrication (back-end , mounting , packaging etc.), Nano imprint
Device
Vehicle sensor, Biosensor / Lab-on-a-chip, Mechanical sensor (Pressure / Accelerating / Gyro), Actuator, Electronic compass, RF-MEMS, Optical MEMS, Environmental sensor (Temperature / Humidity / Gas), Flexible sensor
Application
Environment & Energy, Aerospace, Healthcare & Medical, Life Sciences / Wearable / Sports, Automobile, Food / Agriculture, Smart Monitoring System
Service / Business model
Research and development institutions / University, Nano & Micro Research / Pilot Fab

Application Field
Semiconductor / Electrical Equipment & Component, Optical parts and devices, Precision Equipment / Industrial Machinery / Robotics, Automobile / Logistics / Transporting, Aerospace, Medical Device, Analytical and Measurement Instrument, Surface Treatment, Electric Utility / Gas / Oil / Other energy, Fishery / Agriculture / Mining, University/Research Organization, Foreign Representative / International Organization

Contact

*The following information is provided to enable inquiries to exhibitors.
Unauthorized use and reproduction for any other purpose is prohibited.

Fraunhofer ENAS

Fraunhofer Institute for Electronic Nano Systems ENAS

Technologie-Campus 3, Chemnitz Germany 09126

TEL : +49 371 45001-0
URL : https://www.enas.fraunhofer.de
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