Electroless Copper is a common metallization procedure in PCB manufacturing market. However, it is kind of difficult and expensive for getting a stable quality and getting a high reliability on interconnects through the Electroless Copper. By the way, Electroless Copper consume a big amount of formaldehyde which is confirmed a Level 1 carcinogen.
Direct metallization, without formaldehyde, is the best alternative of the Electroless Copper. MacDermid Alpha continues the investment on upgrading the capability of the Direct Metallization.
A whole new Direct Metallization with graphite base, higher conductivity, lower etch amount is launched for helping PCB manufacturers to get better manufacturing capability on difficult PCBs with a lower power and water consumption.

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As the wire density of package substrates increases, the pitch of through-hole in the core layer becomes narrower. As package substrate becomes larger, there is a large difference of the pitch in through-hole arrangement between high-density areas where wafer chips are mounted and other lower-density areas. When such next-generation package substrates are plated with an electrolytic copper plating bath using a DC rectifier, the deposit thickness tends to be thicker in areas where the through holes are sparse and thinner in dense areas, causing problems with deposit thickness uniformity. To solve this problem, we will introduce THRU-CUP ECP-01, an electrolytic copper plating additive that uses a PPR (Pulse Periodic Reverse) current-controlled rectifier.

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To attend, please come directly to the venue

About "Multi-Hop Frame" that realizes the Bluetooth Virtual Mesh Network.

luetooth mesh network is a revolutionary technology that enables data communication over a wide range by hopping data. On the other hand, a major issue was the large amount of current consumed to maintain the connection.
In this session, we will introduce ``Multi-Hop Frame'', a Bluetooth virtual mesh network that enables data communication over a wide range and operates with ultra-low power consumption that can be powered by coin batteries.
While explaining the mechanism for realizing a "Multi-Hop Frame," we will also introduce specific application examples.

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皆様のお越しをお待ちしております。

Depaneling of assembled printed circuit boards into the era of laser depaneling

Up until now, assembled printed circuit boards have been processed mechanically, such as dicing, routers, and punching. There have been problems with mechanical processing such as stress on the board, burrs, cutting chips, and expensive molds and jigs, but laser depaneling can solve these problems.

On the other hand, laser cutting has the problem of generating heat and burning the cut surface, and the equipment is expensive, making it difficult to implement. LPKF CuttingMaster has developed a new cutting technology, CleanCut, which does not cause carbonization on the cutting surface, making it possible to perform processing that actually does not cause carbonization at all. In addition, by reducing the price of the laser system, the cost performance is comparable to that of a router, making it easier to install.

We bring you the latest information on laser depaneling.

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Reducing contamination defects in PCB manufacturing requires correct knowledge of contamination removal.
Why cannot air blow or brush & vacuum be used to remove the particles smaller than 100 µm?
Are there safe cleaning rollers that do not exude low-molecular-weight siloxanes?
How can small contaminations be removed reliably and safely?
A seminar on the basics of contamination cleaning from the pioneer in cotamination removal, Teknek's Science of Cleaning.

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皆様のご参加を心よりお待ちしております。

Elemental distribution and compositional analysis using an energy dispersive X-ray analyser (EDS) mounted on an electron microscope is widely used for product development and defect analysis of electronic components and packaging components. Oxford Instruments' newly developed "Unity" detector is an innovative detector that combines a reflection electron detector and an X-ray detector in a single sensor head, allowing simultaneous detection. The Unity sensor head is inserted directly under the objective lens of the electron microscope during analysis, allowing for a large detection solid angle and fast analysis of sample surface morphology and elemental distribution. It works in low-vacuum mode, so even charged samples can be analysed easily. In this seminar, examples of the application of Unity to the analysis of electronic components and packaging components will be presented and the fast and efficient elemental analysis method will be explained.

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According to the PKG substrate technology roadmap, the demand for exposure position accuracy is increasing yearly. SCREEN has developed the new Ledia series to meet these demands.
This time, SCREEN would like to introduce some of our latest technologies developed for this equipment.

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尚、他装置メーカー様などの聴講は出来ませんので予めご了承ください。

As an application chemist, I am responsible for measuring samples requested by customers, analyzing data, and providing advice on measurements. I support a wide range of applications such as thermal analysis and viscoelasticity measurement. I'm also actively engaged in marketing activities, and have given numerous presentations at academic conferences to promote our products. Last year, we developed and promoted our own impedance measurement accessories for rheometers.

Thermal analysis and viscoelasticity measurements are widely used as evaluation methods for device materials such as substrate materials, encapsulants, films, adhesives, and conductive pastes. In this lecture, I will explain the basic evaluation methods for device materials, and also how conductive pastes can be sintered using a combined analysis of thermal analysis, viscoelasticity measurement, and electrical property measurement using the Rheo-Impedance measurement method, which has been attracting attention recently. I will also introduce recent hot applications such as in-situ evaluation of the curing process.

To attend, please come directly to the venue

To attend, please come directly to the venue

Introducing the performance of excimer laser processing system that realizes ultra-fine via formation of Φ3um and high overlay accuracy of 1.5um & direct exposure system that supports microcircuit and high precision of next-generation substrates.
Introduction of substrate samples using excimer laser processing system & direct exposure system for fine circuit formation and narrow bump pitch, which are essential for high-density advanced PKGs.