| Exhibition | ： | Smart Sensing 2024 |
|---|---|---|
| Booth | ： | 5E-03-06 |
| Pavilion | ： | Self-powered IoT Pavilion |
- Demo
- Sample
- Presentation
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1
Thermoelectric Generators (Developing)
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- Demo
- Sample
- Presentation
Product/technology Category(10) Electronics Packaging Process Materials including SMDs and EquipmentSmall Electronic Components(11) Electronic Component/Device/Semiconductor(12) Materials and Process Materials of Electronic component, devicesElectronic Component /Device Material /Process Material(21) Sensor devices/nodesSensor/Senser Nodes(22) Semiconductors/electronic devices(23) Communication Devices/Network Systems(24) E-TextileWearable Technology, Wearable Technology Devices(26) Power Electronics related Mountiing / MaterialsThermal Solutions(28)Electronic power supplyPower Supply(AC-DC/DC-DC/Battery, Other Power Supplies(35) All the other technology / product regions：open innovation/co-creationApplication Field(1) Automotive/Automotive Parts, (2) Semiconductors/Devices, (3) Consumer Electronics / Audio-Visual, (4) Computer / Mobile / Network, (5) Communication, (7) Robots, (8) Industrial equipment/Office Automation, (9) Aerospaces, (10) Sensors, (11) Energy, (12) Medical, (14) IoT/Bigdata, (15) FA, Automation, (16) health care/wellness, (17) wearable, (19) Drone, (23) 5G
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2Welsurt
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- Presentation
Product/technology Category(2) IC Packaging SubstrateIC Packaging Board（Inorganic Materials）(3) Embedded ComponentsDevice Embedded Component Type(5) Performance / Inspection Test and Technologies for PWB / IC Packaging Substrate / Embedded ComponentsMeasuring Equipment, Analytical Jigs(6) Main and Insulating Materials for PWB / IC Packaging Substrate/Embedded ComponentsCopper Clad Laminate（Rigid）・Prepreg, Copper Clad Laminate（Flexible）, Materials related to Copper-Clad Laminates, Copper Foils/Metal Foils, Cover Films, Bonding Sheets/Films(7) Processing Technologies or Manufacturing Equipment for PWB / IC Packaging Substrate/Embedded ComponentsLaminating Presses Equipment(10) Electronics Packaging Process Materials including SMDs and EquipmentSmall Electronic Components, Solder/Joining material(11) Electronic Component/Device/Semiconductor(12) Materials and Process Materials of Electronic component, devicesElectronic Component /Device Material /Process Material, Organic EL(21) Sensor devices/nodesSensor/Senser Nodes, Others of Sensor Module(22) Semiconductors/electronic devices(23) Communication Devices/Network Systems(24) E-TextileStretchable technology, Wearable Technology, Wearable Technology Devices, Vital Sensors, Materials (fibre/Conductive materials), Conductive Materials, Knitting/Weaving Technology, Composite Material Technology, Gament Technology, Others of E-Textile(26) Power Electronics related Mountiing / MaterialsPower Semiconductors / Power Devices, Thermal Solutions(28)Electronic power supplyPower Supply(AC-DC/DC-DC/Battery(30) Optics / Materials / Design ToolsCMOS/CCD Imaging Sensor, LiDAR(34) MetaverseAR(Augmented Reality)/VR(Virtual Reality)(35) All the other technology / product regions：open innovation/co-creationApplication Field(1) Automotive/Automotive Parts, (2) Semiconductors/Devices, (3) Consumer Electronics / Audio-Visual, (4) Computer / Mobile / Network, (5) Communication, (7) Robots, (8) Industrial equipment/Office Automation, (9) Aerospaces, (10) Sensors, (11) Energy, (12) Medical, (14) IoT/Bigdata, (15) FA, Automation, (16) health care/wellness, (17) wearable, (19) Drone, (23) 5G
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3
Sheet-Type Peltier Modules (Thermoelectric cooler) (Developing/Reference exhibit)
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- Demo
- Sample
- Presentation
Product/technology Category(3) Embedded ComponentsDevice Embedded Component Type(10) Electronics Packaging Process Materials including SMDs and EquipmentSmall Electronic Components(11) Electronic Component/Device/Semiconductor(12) Materials and Process Materials of Electronic component, devicesElectronic Component /Device Material /Process Material(21) Sensor devices/nodesSensor/Senser Nodes, Others of Sensor Module(22) Semiconductors/electronic devices(23) Communication Devices/Network Systems(24) E-TextileWearable Technology, Wearable Technology Devices(26) Power Electronics related Mountiing / MaterialsPower Semiconductors / Power Devices, Thermal Solutions(28)Electronic power supplyPower Supply(AC-DC/DC-DC/Battery(30) Optics / Materials / Design ToolsCMOS/CCD Imaging Sensor, LiDAR(35) All the other technology / product regions：open innovation/co-creationApplication Field(1) Automotive/Automotive Parts, (2) Semiconductors/Devices, (3) Consumer Electronics / Audio-Visual, (4) Computer / Mobile / Network, (5) Communication, (7) Robots, (8) Industrial equipment/Office Automation, (9) Aerospaces, (10) Sensors, (11) Energy, (12) Medical, (14) IoT/Bigdata, (15) FA, Automation, (16) health care/wellness, (17) wearable, (19) Drone, (23) 5G
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| Company | ： |
LINTEC
New Project Planning office , Business Administration Div. |
|---|---|---|
| Address | ： | 1-1-1 Koishikawa, , Bunkyo-ku, Tokyo, Tokyo Japan 112-0002 |
| URL | ： |
https://www.lintec.co.jp/
|
| Corporate's Handling of personal information URL | ： | https://www.lintec.co.jp/privacy/ |