10:15-10:35

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Techno Alpha Co., Ltd.J

Making PCB boards and substrates without outsourcing, Prototyping boards of flexible electronics Electronic Circuit Printer V-ONE / NOVA

10:55-11:15

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Nordson K.K.J

Hotmelt dispenser: the ultimate solution for bonding, sealing and lubricating of small electronic/wearable device.

11:35-11:55

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Sakigake SemiconductorJ

Introducing new surface modification technology! (Improvement of droplet accuracy by liquid-repellent treatment that does not require coating agents, reduction treatment that does not require gas)

10:55-11:15

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Ningbo Jujia New Material Technology Co., Ltd.J

Liquid crystal polymer (LCP) materials and its application to textiles and electronic components

11:35-11:55

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Oki Electric Cable Co.,Ltd.J

Introduction of our New and Unique FPC.

12:15-12:35

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SOFTAGENCY CO., LTD.J

Simultaneous monitoring of all measuring instruments! With 26 years of experience in software development, we challenge new added value of IoT technology.

12:55-13:15

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Toyo Aluminium K.K.J

Latest Development of Low-Profile Catalytic Aluminum Foil for A-SAP™.

13:35-13:55

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Izuma NetworksJ

The Coming Together of Edge Computing and the Cloud

14:15-14:35

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MITSUBISHI GAS CHEMICAL CO., INC.J

Introduction of BT resin laminates with high dielectric constant

14:55-15:15

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BRUX JAPAN CO., LTD.J

Multi-Step Stencil enabling simultaneous mounting of large and small components with flexible layout

15:35-15:55

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Toyo Aluminium K.K.J

Latest Development of Low-Profile Catalytic Aluminum Foil for A-SAP™.

10:15-10:35

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Techno Alpha Co., Ltd.J

Current status of area laser reflow technology.

10:55-11:15

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USHIO INC.J

Ushio's Liyhography tool and Excimer.

11:35-11:55

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SHIBUYA CORPORATIONJ

Introduction of laser processing machines for substrate and electronic component processing

12:15-12:35

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Techno Alpha Co., Ltd.J

IBL presentation comparison to common reflow process

12:55-13:15

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Dynatron Co.,LTD.J

Data direct solutions

13:35-13:55

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Shimada Appli G.K.J

New film coating system(This is the world's first invention system)

14:15-14:35

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LE-TECHNOLOGY Co., Ltd.J

Introduction of state-of-the-art direct lithography equipment for PKG substrates and creation of market innovations

14:55-15:15

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ANDOR SYSTEM SUPPORT CO., LTD.J

Introduction of JTAG Boundary scan test that solves the problems of BGA package device mounted board inspection

15:35-15:55

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ISHII HYOKI Co., LTDJ

Introduction of inkjet coating technology

10:15-10:35

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Toyo Aluminium K.K.J

Latest Development of Low-Profile Catalytic Aluminum Foil for A-SAP™.

10:55-11:15

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Wonder Future CorporationJ

New manufacturing "MONODUKURI" realized by IH reflow Supports mass production of electronics parts mounting on low-heat and high-heat-dissipation substrates

11:35-11:55

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COMPLEX MICRO INTERCONNNECTION CO.,LTDJ

FPC + Wire harness

12:15-13:15

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CHEMITOX, Inc.J

Introduction of insulation performance evaluation technology for power device materials and how to use UL Data Acceptance program and ASP evaluation

13:35-13:55

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MITSUBISHI GAS CHEMICAL CO., INC.J

Introduction of BT resin laminates for FC-BGA package

14:15-14:35

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PHOTOTECHNICA CORPORATIONJ

Ultra-compact matchbox-sized laser. Introduce the state of art trends and application examples of the MatchBox series.

14:55-15:15

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KanaiJuyoKogyo Co.,LtdJ

New products of Abrasive Wheel for printed circuit board manufacturing process Abrasive wheel that correspond to clogging before forming solder resist Abrasive wheel for removing plugging ink

15:35-15:55

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BRUX JAPAN CO., LTD.J

How to completely remove sub-micron contamination without damaging on PCB

16:15-16:35

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TOAMUSEN DENKI CO.,LTDJ

Creation of DX and new digital marketing

10:15-10:35

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NIKKISO CO., LTD.J

Development of Sintering Equipment for Power Semiconductors Applying 3D Press Technology

10:55-11:15

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ORC MANUFACTURING CO., LTD.J

Introduction to mass production at last! Introduction of excimer laser processing equipment that realizes ultra-fine via processing of Φ3um.

11:35-11:55

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TA Instruments Japan J

Visualize the characteristics of materials! Thermal analysis and viscoelasticity measurements of electronics materials.

12:15-12:35

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ZUKEN Inc.J

Introduction of "3D EMC Adviser", an electro-mechanical integration EMC verification tool

12:55-13:15

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Plasma Ion Assist Co.,Ltd.J

Adoption example of DLC in the manufacturing process of electronic components and semiconductors. Introduction of various functional DLC such as low-dielectric DLC for the 5G communication band.

13:35-13:55

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Nippo LTD.J

Introduction of various low-temperature curing adhesive materials and solder pastes that are compatible with carbon-neutral and low-stress bonding

14:15-14:35

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ONTEC.CO.,LTDJ

Introduction of PCB design AI automatic placement solution

14:55-15:15

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IWAKI CO., LTD.J

Introduction of new product Maglev Pump MJ-100

15:35-15:55

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Hitachi High-Tech ScienceJ

Providing a new user experience~Measurement of various metal coating thickness by the XRF coating thickness gauge FT230

10:15-10:35

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LPKF Laser & Electronics K.K.J

Redefining the Economics of Laser Depeaneling New era of LPKF laser depaneling technology

10:55-11:15

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FANUC CORPORATIONJ

The Latest Technology of FANUC Robots

11:35-11:55

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Meltex Inc.J

Introduction of acid copper plating process for fine line patterning formation.

12:15-12:35

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UNION TOOL .COJ

Latest technical information for PCB tools.

12:55-13:15

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HORIBA, Ltd.J

HORIBA's optical components (gratings, detector, spectrometer and IR modules) and examples of customizing them for each customers.

13:35-13:55

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OKUNO Chemical Industries Co., Ltd.J

Okuno’s solutions by copper electroplating additives for semiconductor package substrates (For large diameter vias, for high-speed transmission, for ultra-fine FOWLP and FOPLP)

14:15-15:15

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Sankyosha Co.,Ltd.J

Using LTspice for PCB design. (Focusing on the trace of the SW power supply section and the inductance component of the VIA.)

15:35-16:35

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PLAMEX CO.,LTD.J

Sustainable plating business with consideration for the future of the earth